Patents by Inventor Dennis C. Shen

Dennis C. Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for making a polymer for an optical substrate by hydrogenating a cycloolefin copolymer
    Patent number: 5319034
    Abstract: Substantially optically clear molding compositions comprising polymerized cycloolefin monomers (e.g., norbornene-type polymers) which, subsequent to polymerization have been hydrogenated are provided. The polymers have a weight average molecular weight of from about 37-47.times.10.sup.3.
    Type: Grant
    Filed: April 16, 1993
    Date of Patent: June 7, 1994
    Assignee: The B. F. Goodrich Company
    Inventors: Dennis C. Shen, Linwood P. Tenney
  • Process for making a polymer for an optical substrate by hydrogenating a cycloolefin copolymer
    Patent number: 5206306
    Abstract: Substantially optically clear molding compositions comprising polymerized cycloolefin monomers (e.g., norbornene-type polymers) which, subsequent to polymerization have been hydrogenated are provided. The polymers have a weight average molecular weight of from about 37-47.times.10.sup.3.
    Type: Grant
    Filed: March 3, 1992
    Date of Patent: April 27, 1993
    Assignee: The B. F. Goodrich Company
    Inventor: Dennis C. Shen
  • Substrate for optical recording media and molding composition therefor
    Patent number: 5115041
    Abstract: Substantially optically clear molding compositions comprising polymerized cycloolefin monomers (e.g., norbornene-type polymers) which, subsequent to polymerization have been hydrogenated are provided. The polymers have a weight average molecular weight of from about 37-47.times.10.sup.3.
    Type: Grant
    Filed: March 31, 1989
    Date of Patent: May 19, 1992
    Assignee: The B. F. Goodrich Company
    Inventors: Linwood P. Tenney, Dennis C. Shen
  • Polyesterimide
    Patent number: 4362861
    Abstract: A low molecular weight polyester-imide resin is prepared wherein there is employed as the dibasic acid either 100% of the diimide dicarboxylic prepared by reacting two moles of trimellitic anhydride with one mole of methylene dianiline (the diimide is abbreviated DID) or oxydianiline or the dibasic acid can also contain a small percent of another aromatic acid. The product is used to produce coated wires having outstanding heat shock. The product also is useful to provide a top coat to wire coated with a polyester or with another polyester-imide.
    Type: Grant
    Filed: October 14, 1981
    Date of Patent: December 7, 1982
    Assignee: Schenectady Chemicals, Inc.
    Inventor: Dennis C. Shen