Abstract: A stencil printer includes a frame, a stencil coupled to the frame, a substrate support coupled to the frame to support a substrate in a print position, and a print head, coupled to the frame, to deposit and print viscous material over the stencil. The print head includes a squeegee assembly having at least one squeegee blade and a squeegee blade movement mechanism configured to move the squeegee blade from a raised position in which the squeegee blade is spaced from stencil and a lowered position in which the squeegee blade engages and applies a force on the stencil. The print head further has a device to detect a first reference point associated with a first force of the squeegee blade against the stencil and a second reference point associated with a second force of the squeegee blade against the stencil when moving the squeegee blade to the lowered position in which the squeegee blade engages and applies a force on the stencil.

Abstract: Disclosed herein is a modular printing system for printing viscous material on electronic substrates. The modular printing system comprises a first stencil printer including a substrate support assembly including a support configured to support and secure the electronic substrate in a print position, and a first system configured to shuttle electronic substrates to and from the first support of the first substrate support assembly, the first system including an upper track and a lower track disposed below the upper track, and at least one second stencil printer including a second substrate support assembly including a support configured to support and secure the electronic substrate in a print position, and a system configured to shuttle electronic substrates to and from the support of the second substrate support assembly, the system including a at least one upper track and a lower track disposed below the upper track.

Abstract: Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including an upper track and a lower track disposed below the upper track.

Abstract: Disclosed herein is method of operating a piece of surface mount technology manufacturing equipment. The method comprises providing a piece of surface mount technology manufacturing equipment having a first substrate transport track disposed in a first position and a second substrate transport track disposed in a second position, moving the first substrate transport track from the first position to a third position, and moving the second substrate transport track from the second position to the first position.

Abstract: Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a print position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including a first track and a second track, the first track being mounted on a first displacement mechanism and the second track being mounted on a second displacement mechanism configured to laterally move the second track relative to the first track, the second displacement mechanism configured to raise the first track relative to the second track.

Abstract: Disclosed herein is a modular system for manufacturing printed circuit boards. The system comprises a plurality of pieces of processing equipment including at least one assembly material applicator, and at least one electronic component placement machine, and a transport system configured to transport circuit boards from the at least one stencil printer to the at least one electronic component placement machine, the system including an upper track and a lower track disposed below the upper track.

Abstract: Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including an upper track and a lower track disposed below the upper track.

Abstract: An apparatus for depositing viscous material on an electronic substrate includes a frame, a dispensing unit coupled to the frame, and a substrate support assembly coupled to the frame. The substrate support assembly includes a plurality of support elements, a table coupled to the frame. The table has a support surface to support at least one support element of the plurality of support elements, and a marking device coupled to the frame. The apparatus further includes an imaging system coupled to the frame. The imaging system is configured to capture images of the support surface of the table. A controller is coupled to at least the marking device and the imaging system, and configured to manipulate the marking device to mark the support surface of the table on predetermined positions and to manipulate the imaging system to verify whether the marks on the support surface of the table are accurate. Embodiments of the apparatus and related methods are further disclosed.

Abstract: A stencil printer includes a frame, a stencil coupled to the frame, a substrate support coupled to the frame to support a substrate in a print position, and a print head, coupled to the frame, to deposit and print viscous material over the stencil. The print head may include a squeegee blade configured to engage the stencil, a squeegee blade mount configured to house the squeegee blade, a squeegee blade movement mechanism configured to move the squeegee blade mount in a z-axis direction from a raised position in which the squeegee blade is spaced from stencil and a lowered position in which the squeegee blade engages and applies a force on the stencil, and a connector configured to pivotally connect the squeegee blade mount to the squeegee blade movement mechanism. The connector may include a load cell configured to measure force of the squeegee blade against the stencil. Other embodiments and related methods are further disclosed.

Abstract: A stencil printer includes a frame, a stencil coupled to the frame, a substrate support coupled to the frame to support a substrate in a print position, and a print head, coupled to the frame, to deposit and print viscous material over the stencil. The print head includes a squeegee assembly having at least one squeegee blade and a squeegee blade movement mechanism configured to move the squeegee blade from a raised position in which the squeegee blade is spaced from stencil and a lowered position in which the squeegee blade engages and applies a force on the stencil. The print head further has a device to detect a first reference point associated with a first force of the squeegee blade against the stencil and a second reference point associated with a second force of the squeegee blade against the stencil when moving the squeegee blade to the lowered position in which the squeegee blade engages and applies a force on the stencil.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, the solder dispensing unit includes a squeegee arm with a solder gathering head. During operation using the squeegee arm with the solder gathering head, two circuit boards are fed to the working area, and both of the circuit boards are serially processed, with excess solder being removed from the board after the processing of each of the boards.

Abstract: A method and apparatus is provided for transporting circuit boards in a screen printer. In embodiments of the present invention, a transportation system is provided for a printer that prints material on a substrate. The transportation system has the ability to independently move substrates from one position to another within the printer without moving other substrates contained within the transportation system. In one embodiment, the transportation system includes a conveyor system and a plurality of lifters that lift substrates off of the conveyor system to prevent at least one substrate from moving when other substrates are moved by the conveyor system. In another embodiment, the transportation system includes a conveyor system and a plurality of retractable pins, that are individually controllable to be raised above the conveyor system to contact at least one substrate on the conveyor system and prevent the substrate from moving when other substrates are moved by the conveyor system.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, a solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, a solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: A dual track stencil system includes a plurality of pairs of adjustable conveyor rails, including a first pair of conveyor rails and a second pair of conveyor rails. The first and second pairs of conveyor rails of the dual track system are advantageously adjustable to accommodate variable width circuit boards or operation of the system in single track mode. The first and second pairs of conveyor rails can be independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: A stencil for a printer used to print a substance onto a substrate using a blade that passes over the stencil during printing. In embodiments of the invention, the stencil includes a first section having a first printing pattern formed thereon, a second section having a second printing pattern formed thereon, a seam between the first section and the second section, and a strip that covers at least a portion of the seam to allow the blade to pass smoothly over the seam.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area at which the circuit boards are stenciled and includes a stencil having two patterns formed thereon. In one embodiment, the stencil system includes a solder dispensing system for dispensing solder paste onto the stencil.

Abstract: A method and apparatus is provided for transporting circuit boards in a screen printer. In embodiments of the present invention, a transportation system is provided for a printer that prints material on a substrate. The transportation system has the ability to independently move substrates from one position to another within the printer without moving other substrates contained within the transportation system. In one embodiment, the transportation system includes a conveyor system and a plurality of lifters that lift substrates off of the conveyor system to prevent at least one substrate from moving when other substrates are moved by the conveyor system. In another embodiment, the transportation system includes a conveyor system and a plurality of retractable pins, that are individually controllable to be raised above the conveyor system to contact at least one substrate on the conveyor system and prevent the substrate from moving when other substrates are moved by the conveyor system.

Abstract: Web displacing apparatus selectively displaces a web between a first position engaging a fluid source and a second position spaced from the fluid source. A web drive is constructed and arranged to move the web in a direction from the fluid source toward a surface for engagement with the web for receiving fluid carried by the web from the fluid source. Web moving structure is constructed and arranged to selectively move the web between the first and second positions.