Abstract: A system and method for automatically generating placement of vias within redistribution layers of a semiconductor package are described. In various implementations, a user defines attributes to use for automatic via generation in redistribution layers of a semiconductor package. The circuitry of a processor of a computing device used by the user executes instructions of an automatic redistribution layer (RDL) via generator. The automatic via generator uses the attributes, data indicative of the RDL netlist of signal routes within the RDL, and RDL mask layout data representing the signal masks of the metal layers within the RDL. The processor generates placement of vias for in the RDL based on the attributes and an identification of overlapping regions between metal layers.

Abstract: A system and method for automatically generating layout masks of power rails within redistribution layers of a semiconductor package are described. In various implementations, a user defines attributes to use for automatic power rail generation in the redistribution layers. The circuitry of a processor of a computing device used by the user executes instructions of a redistribution layer (RDL) automated power rail generator, which is referred to as the power rail generator. The power rail generator uses the attributes and a copy of the RDL netlist of the signal routes within the RDL to generate RDL mask layout data representing the signal routes of the power rails within the RDL. The processor generates the power rails for a significantly large number of signal routes in the RDL based on the received data such as the attributes that allow the user to customize the automatic generation.

Abstract: A system and method for automatically generating placement of vias within redistribution layers of a semiconductor package are described. In various implementations, a user defines attributes to use for automatic via generation in redistribution layers of a semiconductor package. The circuitry of a processor of a computing device used by the user executes instructions of an automatic redistribution layer (RDL) via generator. The automatic via generator uses the attributes, data indicative of the RDL netlist of signal routes within the RDL, and RDL mask layout data representing the signal masks of the metal layers within the RDL. The processor generates placement of vias for in the RDL based on the attributes and an identification of overlapping regions between metal layers.