Patents by Inventor Dennis Kwok-Wai YEE

Dennis Kwok-Wai YEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating catalyst and method
    Patent number: 10066299
    Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.
    Type: Grant
    Filed: February 24, 2013
    Date of Patent: September 4, 2018
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Suk Kwan Kwong, Weijuan Zhou, Wenjia Zhou, Dennis Chit Yiu Chan, Dennis Kwok-Wai Yee
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9809883
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • Process for electroless plating and a solution used for the same
    Patent number: 9783890
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: October 10, 2017
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Martin W. Bayes, Ka-Ming Yip, Chun-Man Chan, Hung-Tat Chan, Tsui-Kiu Li, Lok-Lok Liu
  • PLATING CATALYST AND METHOD
    Publication number: 20170152600
    Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.
    Type: Application
    Filed: January 5, 2017
    Publication date: June 1, 2017
    Inventors: SUK KWAN KWONG, Weijuan ZHOU, Wenjia ZHOU, Dennis Chit Yiu CHAN, Dennis Kwok-Wai YEE
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9611550
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: February 17, 2013
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • Process for electroless plating and a solution used for the same
    Patent number: 9499910
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: November 22, 2016
    Inventors: Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Martin W. Bayes, Ka-Ming Yip, Chun-Man Chan, Hung-Tat Chan, Tsui-Kiu Li, Lok-Lok Liu
  • Plating catalyst and method
    Patent number: 9227182
    Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 5, 2016
    Inventors: Wenjia Zhou, Suk Kwan Kwong, Dennis Chit Yiu Chan, Dennis Kwok Wai Yee, Weijuan Zhou
  • FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
    Publication number: 20150376795
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: July 10, 2015
    Publication date: December 31, 2015
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
    Publication number: 20150322574
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Dennis Kwok-Wai YEE, Michael Chi-Yung TANG, Martin W. BAYES, Ka-Ming YIP, Chun-Man CHAN, Hung-Tat CHAN, Tsui-Kiu LI, Lok-Lok LIU
  • Plating catalyst and method
    Patent number: 9149798
    Abstract: A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: October 6, 2015
    Inventors: Wenjia Zhou, Suk Kwan Kwong, Dennis Chit Yiu Chan, Dennis Kwok Wai Yee
  • PLATING CATALYST AND METHOD
    Publication number: 20140242287
    Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.
    Type: Application
    Filed: February 24, 2013
    Publication date: August 28, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Suk Kwan KWONG, Weijuan ZHOU, Wenjia ZHOU, Dennis Chit Yiu CHAN, Dennis Kwok-Wai YEE
  • FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
    Publication number: 20140178572
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: February 17, 2013
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Andy Lok-Fung CHOW, Dennis Kwok-Wai YEE, Crystal P. L. LI
  • PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
    Publication number: 20140120263
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 1, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Dennis Kwok-Wai YEE, Michael Chi-Yung TANG, Martin W. BAYES, Ka-Ming YIP, Chun-Man CHAN, Hung-Tat CHAN, Tsui-Kiu LI, Lok-Lok LIU