Abstract: A solder reflow machine for removing and replacing electronic components of the pin-grid array type having a large number of leads soldered into a very densely populated printed circuit board. The machine utilizes a heat-transfer liquid and a vacuum to remove the component from the board. The printed circuit board is positioned with the component facing downwardly. A tank containing the heat-transfer liquid is located below the printed circuit board. The apparatus includes a solder reflow head which has a component-engaging vacuum plate with a central opening that is in communication with a vacuum source through a pipe which is pulled downwardly to remove the component. The component is surrounded by a wall in combination with the bottom of the printed circuit board and seals off the liquid flow path.