Patents by Inventor Dennis M. Foster

Dennis M. Foster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996190
    Abstract: The present disclosure relates to aggregating and sharing wellness data. The wellness data can be received by a user device from any number of sensors external or internal to the user device, from a user manually entering the wellness data, or from other users or entities. The user device can securely store the wellness data on the user device and transmit the wellness data to be stored on a remote database. A user of the device can share some or all of the wellness data with friends, relatives, caregivers, healthcare providers, or the like. The user device can further display a user's wellness data in an aggregated view of different types of wellness data. Wellness data of other users can also be viewed if authorizations from those users have been received.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: May 28, 2024
    Assignee: Apple Inc.
    Inventors: Aroon Pahwa, Rebecca L. Weber, Divya Nag, Christopher D. Soli, Lawrence Y. Yang, Stephen O. Lemay, Kevin M. Lynch, Stacey F. Lysik, Dylan R. Edwards, Zachury B. Minjack, Zachery W. Kennedy, Adam L. Beberg, Dennis S. Park, Afshad M. Mistri, Anton M. Davydov, Jay K. Blahnik, Christine M. Eun, James H. Foster, Stephanie M. Greer, Daniel S. Keen, Natalia C. Maric, Gregory B. Novick, Michael O'Reilly, Donald W. Pitschel
  • Patent number: 4801065
    Abstract: A pallet for conveying a plurality of ceramic leadless chip carriers (LCC) through an automated wave soldering machine. The pallet includes recesses formed to receive and contain the LDD's with the lid of the LCC facing into the recess. This results in protecting the lids from the molten solder. Additionally, the recesses are formed in a diamond orientation with a solderable pin placed at the trailing apex of each recess. Both the pin and the diamond orientation prevents solder build up on the trailing conductive pads, resulting in enhancing the coplanarity of the solder on the pads.
    Type: Grant
    Filed: September 30, 1987
    Date of Patent: January 31, 1989
    Assignee: Harris Corporation
    Inventors: Michael L. Colquitt, Robert D. Gerke, Mark A. Kwoka, Dennis M. Foster