Patents by Inventor Dennis Ostendorf

Dennis Ostendorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11952725
    Abstract: Fibrous structures having a surface pattern of a continuous knuckle region and a plurality of discrete pillow regions such that the fibrous structures that retain sufficient Surface Void Volume as measured according to the Surface Void Volume Test Method described herein during use by consumers to provide consumer desirable cleaning performance after bowel movements without providing undesirable negative impacts to softness as measured according to the Emtec Test Method and/or the Plate Stiffness Test Method both described herein, methods for making same, and molding members used in such methods, are provided.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: April 9, 2024
    Assignee: The Procter & Gamble Company
    Inventors: William Ellis Bailey, Ward William Ostendorf, Anthony Paul Bankemper, Douglas Jay Barkey, J. Michael Bills, Paul Dennis Trokhan, Jeffrey Glen Sheehan
  • Patent number: 5708568
    Abstract: An electronic module, particularly an electromagnetic interference module includes an assembly for providing a low impedance ground path for at least one electrical component on a printed circuit board of the module. A chassis of the module is employed as a ground source. The printed circuit board is a rigid flex printed circuit board constructed of multiple circuit layers including flexible and rigid circuit layers. The board has at least one rigid portion with both flexible and rigid circuit layers and at least one flexible portion constructed of at least one flexible circuit layer. An electrical component to be grounded is located on a rigid portion of the board. A flexible circuit layer of the rigid flex printed circuit board is used as a return making a direct ground path from the rigid flex printed circuit board to the chassis for grounding the electrical component.
    Type: Grant
    Filed: June 17, 1996
    Date of Patent: January 13, 1998
    Assignee: Sundstrand Corporation
    Inventor: Dennis Ostendorf