Patents by Inventor Dennis R. Kersch

Dennis R. Kersch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper body power hybrid package and method of manufacture
    Patent number: 4506108
    Abstract: A hybrid microcircuit package especially for high power microcircuits comprises a hard copper base with integral packaged sidewalls, a sealing frame of Kovar or stainless steel is electron beam welded or laser welded to the top surface of said sidewalls, whereby to highly localize the high temperature at the wall tops and not anneal to the remainder of the copper base. A Kovar or stainless steel lid is conventionally sealed to the frame.
    Type: Grant
    Filed: April 1, 1983
    Date of Patent: March 19, 1985
    Assignee: Sperry Corporation
    Inventors: Dennis R. Kersch, Don E. Mitchell