Patents by Inventor Dennis Yen

Dennis Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133736
    Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Pirmin Rombach, Kurt Rasmussen, Dennis Mortensen, Jan Ravnkilde, Cheng-Yen Liu, Jotaro Akiyama, Sushil Bharatan, Troy Chase
  • Publication number: 20220413225
    Abstract: A diagnostic voltage or current path can be used for each MEMS actuator control channel to detect and diagnose faults in the actuator control signal path. Multiple measurement points provide additional capabilities of isolating faults among multiple subassemblies or components in the control signal path. The diagnostic voltage or current path uses ADC(s) and multiplexers to monitor multiple control channels and/or multiple measurement points in each control channel. Digitized voltages, or currents in the case of magnetic actuators, read from the diagnostic ADC are compared to expected values to detect and isolate faults.
    Type: Application
    Filed: January 12, 2022
    Publication date: December 29, 2022
    Inventors: Dennis Yen, Scott McCauley, Kevin Yasumura
  • Publication number: 20060049475
    Abstract: The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.
    Type: Application
    Filed: March 8, 2005
    Publication date: March 9, 2006
    Inventors: Hung-Tung Wang, Chien-Chen Hung, Shun-Lih Tu, Dennis Yen, Chih-Hung Chuang, Huai-Ku Chung, Cheng-Wei Yang, Tsu-An Han