Abstract: Provided is a method of roll-to-roll processing of semiconductor parts, the method including: supplying to a processing unit a first material uncoiled from a first roll for processing at the processing unit; connecting a leading board to a leading portion of the first material before the processing so that the first material led by the leading board is processed during transfer in the processing unit along a path; cutting the leading board from the leading portion of the first material after the processing; and if a terminal edge of the first material begins to be processed at the processing unit, connecting another leading board to a leading portion of a second material uncoiled from a second roll and supplying the second material to the processing unit for processing.

Abstract: Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

Abstract: A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.

Abstract: In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

Abstract: A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.

Abstract: Provided are an apparatus for roll-to-roll manufacturing of semiconductor parts and a method of the roll-to-roll manufacturing. The apparatus includes a material supplying unit continuously supplying a material, a processing unit processing the material supplied by the material supplying unit, a transferring unit transferring the material, a tension adjusting unit adjusting tension of the material in a direction in which the material is being transferred; and a connection operating unit, which is disposed between the material supplying unit and the processing unit, attaching a leading board to a leading portion of the material.

Abstract: Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

Abstract: Provided are a method and apparatus for manufacturing a multi-layer substrate. The method includes: rolling out a base substrate that is rolled up into a substrate supply roll and delivering the base substrate to a compression roller system; compressing and laminating a laminating material on the base substrate in a vacuum state using the compression roller system; and cooling the base substrate on which the laminating material is laminated.

Abstract: In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

Abstract: A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

Abstract: An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.

Abstract: A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

Abstract: An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.