Patents by Inventor Deok Hoon Kim
Deok Hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240196681Abstract: A display apparatus includes a base substrate including a display area in which an image is displayed and a peripheral area adjacent to the display area, a source/drain pattern on the base substrate, the source/drain pattern including a connecting electrode in a pad portion of the peripheral area and a electrode of a thin film transistor in the display area, a planarization insulation layer on the base substrate, the planarization insulation layer contacting a side surface of the connecting electrode and a side surface of the electrode of the thin film transistor, and exposing a top surface of the connecting electrode, a connecting member contacting the connecting electrode, and a driving member including a driving circuit, the driving member being connected to the connecting member.Type: ApplicationFiled: February 23, 2024Publication date: June 13, 2024Applicant: Samsung Display Co., LTD.Inventors: Dong Hyun SON, Sung Hoon MOON, Sung Jun KIM, Kohei EBISUNO, Deok Hoi KIM, Sanghoon OH
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Publication number: 20240190305Abstract: A seat for a vehicle includes a reclining unit, a tilting unit, a sliding unit, and a control unit configured to control driving of the reclining unit, the tilting unit and the sliding unit. A method for controlling the seat implemented by the control unit may limit or enforce at least one of an angle adjustment amount of the tilting unit and an angle adjustment amount of the reclining unit by linking at least one of a sensed tilting angle of the seat cushion and a sensed position of the seat with a support angle of a seatback.Type: ApplicationFiled: June 7, 2023Publication date: June 13, 2024Inventors: Kug Hun Han, Sang Soo Lee, Sang Hark Lee, Dong Hoon Lee, Mun Seung Kang, Deok Soo Lim, Yo Han Kim
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Publication number: 20240190306Abstract: A seat folding system includes a folding seat having a seat plate and a backrest, a folding seat adjustment unit having a seat plate adjustment unit for adjusting a height of the seat plate, a slide adjustment unit for adjusting a position of the seat plate in a forwards and backwards direction, and a backrest folding seat adjustment unit for adjusting an angle of the backrest, and a control unit for controlling the folding seat adjustment unit such that folding is able to start in a reference state in which the folding seat is preset.Type: ApplicationFiled: May 17, 2023Publication date: June 13, 2024Inventors: Dong Hoon Lee, Sang Soo Lee, Sang Hark Lee, Yo Han Kim, Mun Seung Kang, Deok Soo Lim, Kug Hun Han
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Patent number: 11990270Abstract: An aspect of the present disclosure provides a bus bar as a winding in a core of a transformer includes multiple sub-bars arranged horizontally and connected in parallel so as to minimize an AC current in the transformer, and the sub-bars have different widths and thus resistances or impedances with respect to a current flowing through the sub-bars are the same. Another aspect of the present disclosure provides a method of designing a bus bar for resistance or impedance matching between multiple sub-bars included in the bus bar to share a current to minimize an AC current in the transformer. Another aspect of the present disclosure provides a transformer, for a DC-DC converter for use in a vehicle, which is manufactured by the method of designing a bus bar.Type: GrantFiled: November 23, 2021Date of Patent: May 21, 2024Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Tae Ho Bang, Deok Kwan Choi, Won Gon Kim, Min Heo, Ji Hoon Park, Kang Min Kim, A Ra Lee, Hyun Woo Shim, Du Ho Kim, Soo Min Jeon
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Patent number: 11950471Abstract: A display apparatus includes a base substrate including a display area in which an image is displayed and a peripheral area adjacent to the display area, a source/drain pattern on the base substrate, the source/drain pattern including a connecting electrode in a pad portion of the peripheral area and a electrode of a thin film transistor in the display area, a planarization insulation layer on the base substrate, the planarization insulation layer contacting a side surface of the connecting electrode and a side surface of the electrode of the thin film transistor, and exposing a top surface of the connecting electrode, a connecting member contacting the connecting electrode, and a driving member including a driving circuit, the driving member being connected to the connecting member.Type: GrantFiled: January 6, 2023Date of Patent: April 2, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Dong Hyun Son, Sung Hoon Moon, Sung Jun Kim, Kohei Ebisuno, Deok Hoi Kim, Sanghoon Oh
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Publication number: 20240075853Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.Type: ApplicationFiled: April 13, 2023Publication date: March 7, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
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Patent number: 8487437Abstract: An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device.Type: GrantFiled: September 17, 2010Date of Patent: July 16, 2013Assignee: Optopac Co., Ltd.Inventors: Peter Elenius, Deok Hoon Kim, Young Sang Cho
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Patent number: 8486318Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.Type: GrantFiled: May 19, 2011Date of Patent: July 16, 2013Assignees: Optopac Co., Ltd., Korea Advanced Institute of Science and Technology, Micropack Co., Ltd.Inventors: Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
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Publication number: 20120231260Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.Type: ApplicationFiled: May 19, 2011Publication date: September 13, 2012Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM
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Publication number: 20120228805Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.Type: ApplicationFiled: May 19, 2011Publication date: September 13, 2012Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM
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Publication number: 20120231689Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.Type: ApplicationFiled: March 29, 2011Publication date: September 13, 2012Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, Korea Advanced Institute of Science and TechnologyInventors: Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
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Publication number: 20110193231Abstract: An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device.Type: ApplicationFiled: September 17, 2010Publication date: August 11, 2011Applicant: OPTOPAC CO., LTD.Inventors: Peter ELENIUS, Deok Hoon KIM, Young Sang CHO
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Publication number: 20100237498Abstract: A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate.Type: ApplicationFiled: October 28, 2008Publication date: September 23, 2010Applicant: OPTOPAC CO., LTD.Inventors: Deok Hoon Kim, Young Sang Cho, Hwan Chul Lee
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Patent number: 7494848Abstract: An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.Type: GrantFiled: September 15, 2006Date of Patent: February 24, 2009Assignee: OptoPac, Inc.Inventor: Deok-Hoon Kim
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Patent number: 7384818Abstract: A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.Type: GrantFiled: October 24, 2006Date of Patent: June 10, 2008Assignee: Optopac, Inc.Inventors: Deok-Hoon Kim, Hwan-Chul Lee
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Patent number: 7291518Abstract: A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths and a sensing portion having at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths. The assembly portion is formed with at least one metal layer disposed on the substrate about a front surface region thereof, and at least one passivation layer formed to extend over the metal layer. The passivation layer is patterned to define a plurality of first and second access openings respectively about a plurality of first solder wettable pads and at least one second solder wettable pad on the metal layer.Type: GrantFiled: May 18, 2005Date of Patent: November 6, 2007Assignee: Optopac, Inc.Inventor: Deok-Hoon Kim
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Publication number: 20070042530Abstract: A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.Type: ApplicationFiled: October 24, 2006Publication date: February 22, 2007Inventors: Deok-Hoon Kim, Hwan-Chul Lee
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Publication number: 20070007667Abstract: An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.Type: ApplicationFiled: September 15, 2006Publication date: January 11, 2007Inventor: Deok-Hoon Kim
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Patent number: 7141869Abstract: A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.Type: GrantFiled: February 9, 2005Date of Patent: November 28, 2006Assignee: Optopac, Inc.Inventors: Deok-Hoon Kim, Hwan-Chul Lee
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Patent number: 7126164Abstract: A wafer-level CSP (200) includes at least one die (202) from a wafer. The wafer-level CSP has a plurality of solder ball pads (206), a solder ball (308) at each solder ball pad and a polymer collar (310) around each solder ball. A moat (204) is formed in the surface of a polymer layer (412) disposed on the wafer during manufacturing of the wafer-level CSP. A temporarily liquified residual (502) from the polymer collar, which occurs while the wafer is heated to the reflow temperature of the solder ball, flows from the polymer collar. The moat acts as a barrier to material flow, limiting the distance that the residual spreads while liquified. The residual from the polymer collar remains within a region (314) defined by the moat. A full-depth moat (312) extends completely through the polymer layer. Alternatively, a partial-depth moat (712 and 912) extends partially through the polymer layer.Type: GrantFiled: September 26, 2003Date of Patent: October 24, 2006Assignee: FlipChip International LLCInventors: Michael E. Johnson, Peter Elenius, Deok Hoon Kim