Patents by Inventor Der-jin Woan
Der-jin Woan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7329816Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.Type: GrantFiled: June 8, 2005Date of Patent: February 12, 2008Assignee: International Business Machines CorporationInventors: Donald S. Farquhar, James D. Herard, Michael J. Klodowski, David Questad, Der-jin Woan
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Publication number: 20080022519Abstract: A laminating method. A structure that includes first and second dielectric layers respectively positioned on opposing surfaces of a thermally conductive layer is pressurized between 1000 and 3000 psi concurrent with being subjected to a thermal process, including the steps of: (a) heating the structure from ambient room temperature to a temperature between 670° F. to 695° F. in a heatup stage of duration 42 to 57 minutes; (b) after step (a), maintaining the structure at an approximately constant temperature between 670° F. and 695° F. in a dwell stage of duration 105 to 125 minutes; (c) after step (b), cooling the structure to 400° F. in a slow cool stage of duration of 120 to 150 minutes, wherein step (c) is performed after step (b); and (d) after step (3), cooling the structure to ambient room temperature in a rapid cool stage of duration less than 180 minutes.Type: ApplicationFiled: October 2, 2007Publication date: January 31, 2008Inventors: Donald Farquhar, James Herard, Michael Klodowski, David Questad, Der-jin Woan
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Patent number: 7059049Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.Type: GrantFiled: September 24, 2002Date of Patent: June 13, 2006Assignee: International Business Machines CorporationInventors: Donald S. Farquhar, James D. Herard, Michael J. Klodowski, David Questad, Der-jin Woan
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Publication number: 20050224961Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.Type: ApplicationFiled: June 8, 2005Publication date: October 13, 2005Inventors: Donald Farquhar, James Herard, Michael Klodowski, David Questad, Der-jin Woan
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Publication number: 20030020156Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.Type: ApplicationFiled: September 24, 2002Publication date: January 30, 2003Applicant: International Business Machines CorporationInventors: Donald S. Farquhar, James D. Herard, Michael J. Klodowski, David Questad, Der-Jin Woan
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Patent number: 6349871Abstract: A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.Type: GrantFiled: January 16, 2001Date of Patent: February 26, 2002Assignee: International Business Machines CorporationInventors: Norman A. Card, Jr., James M. Ergler, James D. Herard, Paul R. Kasperek, Richard S. McKinley, Der-jin Woan
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Patent number: 6216938Abstract: A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.Type: GrantFiled: September 30, 1999Date of Patent: April 17, 2001Assignee: International Business Machines CorporationInventors: Norman A. Card, Jr., James M. Ergler, James D. Herard, Paul R. Kasperek, Richard S. McKinley, Der-jin Woan