Patents by Inventor Der-woei Wu

Der-woei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240160298
    Abstract: Techniques for controlling a remotely controllable device are described. In an example, a mobile device detects a remotely controllable device, measures a distance and direction from the mobile device to the remotely controllable device, and determines from the distance and direction that the mobile device is pointing at the remotely controllable device. In response to determining that the mobile device is in a handheld position, is pointing at the remotely controllable device, or both, the mobile device monitors for a movement of the mobile device according to a prescribed gesture. In response to detecting that the mobile device was moved according to the prescribed gesture, the mobile device presents a collection of selectable actions control operations of the remotely controllable device.
    Type: Application
    Filed: November 29, 2022
    Publication date: May 16, 2024
    Applicant: Google LLC
    Inventors: Rajeev Nongpiur, Roy Want, Qian Zhang, JinJie Chen, Der-Woei Wu, Cody Wortham, Aleksandr Salo, Marie Vachovsky
  • Publication number: 20240098527
    Abstract: This document describes improvements in range and reliability for wireless mesh networks implementing IEEE 802.11 networking technologies. Reducing the number of spatial streams, N, to a lower value at middle and far distance ranges using an optimized rate control algorithm, preemptively trades off a lower throughput limit for a higher link budget. This higher link budget provides longer range and higher RF link reliability by using an N×N spatial diversity of MIMO RF channels for maximizing link budget instead of network throughput.
    Type: Application
    Filed: February 4, 2022
    Publication date: March 21, 2024
    Applicant: Google LLC
    Inventors: Yu Wen, Zhifeng Cai, Srinivasa Kumar Duvvuri, Raymond Reynolds Hayes, Kevin N. Hayes, Der-Woei Wu
  • Publication number: 20230170930
    Abstract: This disclosure describes apparatuses, methods, and techniques for supporting multiple protocols with selective amplification, such as 5 GHz Wi-Fi®, 2.4 GHz Wi-Fi®, 2.4 GHz Bluetooth Classic®, 2.4 GHz BLE®, and/or 2.4 GHz IEEE 802.15.4 (e.g., Thread® or ZigBee®) protocols. In more detail, the disclosure describes a multi-protocol transceiver system that includes a front-end architecture, which enables the multi-protocol transceiver system to transmit and receive the wireless communication signals according to the multiple protocols. The multi-protocol transceiver system may utilize one or more antennas to transmit and receive the multiple protocols.
    Type: Application
    Filed: April 7, 2020
    Publication date: June 1, 2023
    Applicant: Google LLC
    Inventor: Der-Woei Wu
  • Patent number: 8791767
    Abstract: An integrated circuit (IC) for compensating for a package inductance is disclosed. A first ground pad is directly connected to an on-chip ground node. A second IC ground pad is connected to the on-chip ground node via a tunable capacitor circuit, where the capacitance of the tunable capacitor circuit resonates with the package inductance at the operating frequency of the IC.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: July 29, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: ByungWook Min, Der-Woei Wu
  • Patent number: 8427796
    Abstract: Improved ESD protection circuits for RFICs requiring both high voltage and high frequency operation is described. A cascode grounded gate snap-back NFET (GGNFET) combined with a precharge circuit and a diode network results in a positive ESD protection clamp with low capacitance and high turn-on voltage. The positive ESD protection clamp provides ESD protection to an IC during a positive voltage ESD pulse. Exemplary embodiments of a negative ESD protection clamp are disclosed where a bias circuit or a charge pump is used in place of the precharge circuit in a manner that allows the combination of the bias circuit or the charge pump together with a diode network and a cascode grounded gate snap-back NFET to provide protection against negative ESD voltage pulses. The combination of a positive and a negative ESD protection clamp provides ESD protection to an IC during either a positive or a negative voltage ESD pulse.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: April 23, 2013
    Assignee: QUALCOMM, Incorporated
    Inventors: Eugene R. Worley, ByungWook Min, Der-woei Wu
  • Publication number: 20120105167
    Abstract: An integrated circuit (IC) for compensating for a package inductance is disclosed. A first ground pad is directly connected to an on-chip ground node. A second IC ground pad is connected to the on-chip ground node via a tunable capacitor circuit, where the capacitance of the tunable capacitor circuit resonates with the package inductance at the operating frequency of the IC.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 3, 2012
    Applicant: QUALCOMM INCORPORATED
    Inventors: ByungWook Min, Der-Woei Wu
  • Publication number: 20110176245
    Abstract: Improved ESD protection circuits for RFICs requiring both high voltage and high frequency operation is described. A cascode grounded gate snap-back NFET (GGNFET) combined with a precharge circuit and a diode network results in a positive ESD protection clamp with low capacitance and high turn-on voltage. The positive ESD protection clamp provides ESD protection to an IC during a positive voltage ESD pulse. Exemplary embodiments of a negative ESD protection clamp are disclosed where a bias circuit or a charge pump is used in place of the precharge circuit in a manner that allows the combination of the bias circuit or the charge pump together with a diode network and a cascode grounded gate snap-back NFET to provide protection against negative ESD voltage pulses. The combination of a positive and a negative ESD protection clamp provides ESD protection to an IC during either a positive or a negative voltage ESD pulse.
    Type: Application
    Filed: March 26, 2010
    Publication date: July 21, 2011
    Applicant: QUALCOMM INCORPORATED
    Inventors: Eugene R. Worley, ByungWook Min, Der-woei Wu