Patents by Inventor Derrick E. Cook

Derrick E. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8775020
    Abstract: In at least one embodiment, an apparatus for transmitting vehicle information to an occupant communication device (OCD) is provided. The system comprises a communication module positioned within the vehicle. The communication device is configured to receive a transmission status signal indicative of a transmission mode for the vehicle. The communication device is further configured to transmit the transmission status signal over a wireless protocol to the OCD such that the OCD is disabled from being controlled by switches positioned thereon if the transmission mode enables movement of the vehicle.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: July 8, 2014
    Assignee: Ford Global Technologies, LLC
    Inventors: Thomas Lee Miller, Brian Bennie, David Anthony Hatton, Douglas Paul Walser, Derrick E. Cook
  • Publication number: 20120119936
    Abstract: In at least one embodiment, an apparatus for transmitting vehicle information to an occupant communication device (OCD) is provided. The system comprises a communication module positioned within the vehicle. The communication device is configured to receive a transmission status signal indicative of a transmission mode for the vehicle. The communication device is further configured to transmit the transmission status signal over a wireless protocol to the OCD such that the OCD is disabled from being controlled by switches positioned thereon if the transmission mode enables movement of the vehicle.
    Type: Application
    Filed: May 7, 2010
    Publication date: May 17, 2012
    Applicant: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Thomas Lee Miller, Brian Bennie, David Anthony Hatton, Douglas Paul Walser, Derrick E. Cook
  • Publication number: 20020196646
    Abstract: Method and apparatus for utilizing heat-energy produced as a by-product from a DC to DC converter for productive purposes. The method includes providing a DC to DC converter adapted to be installed into an incorporating arrangement, such as a transport vehicle. The DC to DC converter produces heat-energy as a by-product of operation. The DC to DC converter is arranged in thermal communication with a receiving arrangement, such as a windshield assembly, for transferring heat from the DC to DC converter to the receiving arrangement. The receiving arrangement is of a nature that is advantageously affected by heat transferred thereto from the DC to DC converter. The receiving arrangement is utilized as a heat sink for accepting heat-energy produced as a by-product from the DC to DC converter during operation and the heat sink advantageously cools the DC to DC converter during operation.
    Type: Application
    Filed: December 13, 2001
    Publication date: December 26, 2002
    Inventors: Derrick E. Cook, Peter A. Hatch, Paul W. Keberly
  • Publication number: 20020162673
    Abstract: The invention is a doped synthetic polymer materials for packaging of power electric assemblies. The polymer provides electromagnetic interference (EMI) shielding using such materials as nickel, carbon fiber, aluminum or other such characteristic elements. The invention provides structural integrity for power electronic packaging, while reducing cost, size, weight and design flexibility over the prior art. The illustrated embodiment is a liquid cooled turbulent flow power electronic assembly.
    Type: Application
    Filed: May 3, 2001
    Publication date: November 7, 2002
    Inventors: Derrick E. Cook, Peter A. Hatch, Paul William Keberly
  • Publication number: 20020162672
    Abstract: The invention is a doped synthetic polymer material for packaging of power electric assemblies. The polymer provides electromagnetic interference (EMI) shielding using such materials as nickel, carbon fiber, aluminum or other such characteristic elements. The invention provides structural integrity for power electronic packaging, while reducing cost, size, weight and design flexibility over the prior art.
    Type: Application
    Filed: May 3, 2001
    Publication date: November 7, 2002
    Inventors: Derrick E. Cook, Peter A. Hatch, Paul William Keberly