Patents by Inventor Derrick W. Foster
Derrick W. Foster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7655093Abstract: A wafer support system comprising a susceptor having top and bottom sections and gas flow passages therethrough. One or more spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: January 29, 2007Date of Patent: February 2, 2010Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 7186298Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: August 18, 2003Date of Patent: March 6, 2007Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Publication number: 20040198153Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: ApplicationFiled: August 18, 2003Publication date: October 7, 2004Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6692576Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: September 13, 2002Date of Patent: February 17, 2004Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Patent number: 6608287Abstract: The chamber has a lenticular cross-section with a horizontal support plate extending between sides of the chamber. A rectangular aperture is formed in the support plate for positioning a rotatable susceptor. A temperature compensation ring surrounds the susceptor and is supported by fingers connected to the support plate. The ring may be circular or may conform to the shape of the support plate aperture. The ring may extend farther downstream from the susceptor than upstream. A sacrificial quartz plate may be provided between the circular ring and the rectangular aperture. The quartz plate may have a horizontal portion and a vertical lip in close abutment with the aperture to prevent devitrification of the support plate. A gas injector abuts an inlet flange of the chamber and injects process gas into an upper region and purge gas into a lower region.Type: GrantFiled: August 1, 2002Date of Patent: August 19, 2003Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Derrick W. Foster
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Publication number: 20030075274Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: ApplicationFiled: September 13, 2002Publication date: April 24, 2003Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6491757Abstract: An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat sources at a selected ratio between the sources. The controller is configured to vary the ratio during a high temperature processing cycle of a substrate to thereby vary the ratio of the heat provided by the heat sources during the cycle.Type: GrantFiled: August 17, 2001Date of Patent: December 10, 2002Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Publication number: 20020179586Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate.Type: ApplicationFiled: August 1, 2002Publication date: December 5, 2002Inventors: John F. Wengert, Loren R. Jacobs, Michael W. Halpin, Derrick W. Foster, Cornelius A. van der Jeugd, Robert M. Vyne, Mark R. Hawkins
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Patent number: 6464792Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate.Type: GrantFiled: July 11, 2000Date of Patent: October 15, 2002Assignee: ASM America, Inc.Inventors: John F. Wengert, Loren R. Jacobs, Michael W. Halpin, Derrick W. Foster, Cornelius A. van der Jeugd, Robert M. Vyne, Mark R. Hawkins
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Patent number: 6454866Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: July 10, 2000Date of Patent: September 24, 2002Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6343183Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: June 27, 2000Date of Patent: January 29, 2002Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Publication number: 20010054390Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: ApplicationFiled: August 17, 2001Publication date: December 27, 2001Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6203622Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support wafers in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The susceptor support arms are hollow and conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages within the segmented susceptor are arranged to provide even heat distribution from the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: January 11, 2000Date of Patent: March 20, 2001Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Patent number: 6113702Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: September 4, 1997Date of Patent: September 5, 2000Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6093252Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate.Type: GrantFiled: April 25, 1996Date of Patent: July 25, 2000Assignee: ASM America, Inc.Inventors: John F. Wengert, Loren R. Jacobs, Michael W. Halpin, Derrick W. Foster, Cornelius A. van der Jeugd, Robert M. Vyne, Mark R. Hawkins
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Patent number: 6086680Abstract: A wafer susceptor for semiconductor processing devices, having a thermal mass which is close to that of the wafer. The similarity between the thermal masses of the susceptor and wafer enables a higher throughput and reduces temperature uniformities across the wafer. The low-mass susceptor may be made of a solid, thin disk with or without a central wafer support recess. A wafer temperature sensing aperture may be provided in the center of the susceptor. Alternatively, a low-mass susceptor is formed with an open-celled silicon carbide foam, with or without a thin skin of solid silicon carbide on the top forming a wafer support surface, or completely encapsulating the open-celled foam. The wafer is preferably supported on a plurality of pins extending upward from the susceptor. In a third embodiment, an ultra low-mass susceptor is formed as a ring with a central throughbore and a surrounding wafer support shelf below an outer ledge.Type: GrantFiled: March 26, 1996Date of Patent: July 11, 2000Assignee: ASM America, Inc.Inventors: Derrick W. Foster, Cornelius A. van der Jeugd, John F. Wengert
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Patent number: 6053982Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support wafers in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The susceptor support arms are hollow and conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages within the segmented susceptor are arranged to provide even heat distribution from the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: August 30, 1996Date of Patent: April 25, 2000Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Patent number: 4720395Abstract: Thermal CVD process for forming Si.sub.3 N.sub.4 -type films on substrates by reaction of gaseous NF.sub.3 with gaseous disilane at a temperature in the range of 250.degree.-500.degree. C., at pressures of 0.1-10 Torr. The mole ratio of NF.sub.3 to silane is in the range of 0.5-3.0 and the reaction zone is preferably isothermal (T controlled to within .sup.+ 5.degree. C.). The resulting films have RI's in the range of 1.4 to 3.0. The process parameters can be controlled to dope the film with H and/or F, or to create zones of differing properties within the film. The process does not cause radiation damage, metal migration, stored charge dissipation or high levels of impurities. Control of distance between adjacent wafers and wafer-to-wall spacing combined with laminar gas flow gives excellent film thickness uniformity, on the order of below about .+-.5% across the wafer face, both within (across) wafers and from wafer to wafer (batch uniformity).Type: GrantFiled: August 25, 1986Date of Patent: January 19, 1988Assignee: Anicon, Inc.Inventor: Derrick W. Foster
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Patent number: 4548159Abstract: A chemical vapor deposition wafer boat for polysilicon deposition in a vertical CVD apparatus comprises upper and lower, mutually engaging, open ended hemicylinders. Gas flow passageways are present in a diffusion zone of the lower hemicylinder wall, but not in the remainder of the walls of the hemicylinder. Gas flow to the wafers is limited to diffusion flow, and the wafers are protected from particulates forming in the gas stream during the coating operation.Type: GrantFiled: July 6, 1984Date of Patent: October 22, 1985Assignee: Anicon, Inc.Inventors: Derrick W. Foster, Robert B. Herring