Abstract: An actuation system for a drive unit of a motor vehicle includes a control unit which is assigned to the drive unit and which has a function level, a function monitoring level, and having a power output stage for actuating the drive unit or actuators or sensors which are assigned to the drive unit. To relieve the function a data transmission device for outputting data to a data bus is arranged in the function monitoring level. The data transmission device can output a drive setpoint torque to the drive unit, to actuators or sensors which are assigned to it, or to a power output stage (9, 9?) of a separate, second drive unit.

Abstract: The invention relates to an actuation system for a drive unit of a motor vehicle, having has a drive control unit which is assigned to the drive unit and which has a function level and a function monitoring level. A (4), a first data transmission device (5) which is arranged in the function level (3), of the drive control unit and is connected to a separate external control unit via a first communication path via which a predefined setpoint torque (Msoll) can be forwarded from the external control unit to the first data transmission device. In addition, the drive control unit also has a second data transmission device which is likewise additionally connected to the external control unit via a second communication path. The same predefined setpoint torque can also be forwarded from the external control unit to the second data transmission device via the second communication path.

Abstract: Sub-field enhanced global alignment (SEGA) methods for aligning reconstituted wafers in a lithography process are disclosed. The SEGA methods provide the ability to accommodate chip placement errors for chips supported by a reconstituted wafer when performing a lithographic process having an overlay requirement. The SEGA methods include measuring chip locations to determine sub-fields of the reconstituted wafer over which enhanced global alignment (EGA) can be performed on the chips therein to within the overlay requirement. The SEGA methods further included individually performing EGA over the respective sub-fields. The SEGA methods take advantage of the benefits of both EGA and site-by-site alignment and are particularly applicable to wafer-level packing lithographic processes such as fan-out wafer-level packaging.

Abstract: The invention relates to an actuation system for a drive unit of a motor vehicle, having a drive control unit (1) which is assigned to the drive unit and which has a function level (3) and a function monitoring level (4), a first data transmission device (5) which is arranged in the function level (3), and is connected to a separate external control unit (2) via a first communication path (A) via which a predefined setpoint torque (Msoll) can be forwarded from the external control unit (2) to the first data transmission device (5). The object of the invention is to provide a highly available actuation system. According to the invention, the object is achieved in that the drive control unit (1) has a second data transmission device (6), and is additionally connected to the external control unit (2) via a second communication path (B), wherein the predefined setpoint torque (Msoll) can be forwarded from the external control unit (2) to the second data transmission device (5) via the second communication path.

Abstract: Sub-field enhanced global alignment (SEGA) methods for aligning reconstituted wafers in a lithography process are disclosed. The SEGA methods provide the ability to accommodate chip placement errors for chips supported by a reconstituted wafer when performing a lithographic process having an overlay requirement. The SEGA methods include measuring chip locations to determine sub-fields of the reconstituted wafer over which enhanced global alignment (EGA) can be performed on the chips therein to within the overlay requirement. The SEGA methods further included individually performing EGA over the respective sub-fields. The SEGA methods take advantage of the benefits of both EGA and site-by-site alignment and are particularly applicable to wafer-level packing lithographic processes such as fan-out wafer-level packaging.

Abstract: An actuation system for a drive unit of a motor vehicle includes a control unit which is assigned to the drive unit and which has a function level, a function monitoring level, and a power output stage for actuating the drive unit or actuators or sensors which are assigned to the drive unit. To relieve the function level, a data transmission device for outputting data to a data bus is arranged in the function monitoring level. The data transmission device can output a drive setpoint torque to the drive unit, to actuators or sensors which are assigned to it, or to a power output stage (9, 9?) of a separate, second drive unit.