Abstract: A semiconductor device package is formed by mounting a semiconductor die on an adhesive tape substrate, mounting a sacrificial structure on the adhesive tape substrate, applying molding material on the adhesive tape substrate to embed the die and at least a portion of the at least one sacrificial structure; removing the adhesive tape substrate to define a package assembly, forming a redistribution layer on a surface of the package assembly, and removing sacrificial material to form a void in the molding material having a shape corresponding to a shape of the sacrificial material that was removed.

Abstract: The invention relates to a method for producing an optical arrangement (10, 300), in which an optical component (355, 20) is optically connected to at least one waveguide (90, 320, 330) provided on or in a carrier substrate (100, 310). In order to enable an optical component to be connected to an optical waveguide of a carrier substrate in a particularly simple and thus cost-effective manner, the invention provides for there to be arranged between the optical component (20, 355) and the waveguide (90, 320, 330) an adjustment device (40, 350) with at least one auxiliary waveguide (60, 410, 440), the waveguide ends (50, 70, 400, 420, 430, 450) of which are in each case movable and an optical adjustment between the optical component (20, 355) and the waveguide (90, 320, 330) of the carrier substrate (100, 310) is effected by a mechanical adjustment of the movable waveguide ends (50, 70, 400, 420, 430, 450).

Abstract: A method and a device for producing large-area planar wave guide structures is described. A planar substrate is provided with channel-shaped structures and the channel-shaped structures are filled with a wave guide material. The channel-shaped structures are introduced sequentially into the substrate by a stamping tool, the substrate and the stamping tool are moved relative to one another. Therefore, it is easy and inexpensive to apply precise wave guide structures to surfaces of any desired size.

Abstract: The invention relates to a method for producing an optical arrangement (10, 300), in which an optical component (355, 20) is optically connected to at least one waveguide (90, 320, 330) provided on or in a carrier substrate (100, 310). In order to enable an optical component to be connected to an optical waveguide of a carrier substrate in a particularly simple and thus cost-effective manner, the invention provides for there to be arranged between the optical component (20, 355) and the waveguide (90, 320, 330) an adjustment device (40, 350) with at least one auxiliary waveguide (60, 410, 440), the waveguide ends (50, 70, 400, 420, 430, 450) of which are in each case movable and an optical adjustment between the optical component (20, 355) and the waveguide (90, 320, 330) of the carrier substrate (100, 310) is effected by a mechanical adjustment of the movable waveguide ends (50, 70, 400, 420, 430, 450).

Abstract: Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.

Abstract: Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.

Abstract: A method and a device for producing large-area planar wave guide structures is described. A planar substrate is provided with channel-shaped structures and the channel-shaped structures are filled with a wave guide material. The channel-shaped structures are introduced sequentially into the substrate by a stamping tool, the substrate and the stamping tool are moved relative to one another. Therefore, it is easy and inexpensive to apply precise wave guide structures to surfaces of any desired size.