Patents by Inventor Devi P. Malladi

Devi P. Malladi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper cleaning and passivating for tape automated bonding
    Patent number: 4714517
    Abstract: In the preparation of copper parts for the tape automated bonding of semiconductor devices, the copper parts are subjected to a mild organic acid. This treatment etches the copper, removes contaminants and passivates the surfaces so that subsequent oxidation is retarded. In the case where the copper parts are the bumps on a semiconductor wafer selective etching is avoided.
    Type: Grant
    Filed: May 8, 1986
    Date of Patent: December 22, 1987
    Assignee: National Semiconductor Corporation
    Inventors: Devi P. Malladi, Ranjan Mathew, Divyesh P. Shah