Abstract: Systems and methods for cold chain deliveries are provided. In some embodiments, a method of operating a tote to enable cold chain delivery, the method comprising one or more of: providing storage of one or more cold products in the tote in a micro-fulfillment center; facilitating a pick and pack process of one or more cold products where the one or more cold products are picked from a tote and/or are packed into a tote; and dispensing the one or more cold products using a tote. In this way, cold chain requirement compliance is improved while saving time, money, and energy.

Abstract: Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.

Abstract: Systems and methods for an actively cooled container comprising: a power subsystem; an active cooling subsystem; and a control subsystem are provided. In some embodiments, the control subsystem is configured to: determine that additional cooling is needed; cause the active cooling subsystem to cool the actively cooled container below a lower limit; determine to end the additional cooling; and cause the active cooling subsystem to cool the actively cooled container at or above the lower limit. In this way, the best balance between a fast cooldown time and not damaging (e.g., through freezing) the product load (e.g., beverages), is achieved.

Abstract: Systems and methods are disclosed herein for fluid-dynamic isolation of actively conditioned and return air flow in unconstrained environments. In some embodiments, a system for fluid-dynamic isolation of actively conditioned and return air flow in an unconstrained environment includes: a heat pump subsystem configured to create a conditioned air circuit; and an air curtain subsystem configured to create an air curtain air circuit that isolates the conditioned air circuit from an environment that is external to the system. In this way, conditioned air can be provided in spaces that were impractical before. In addition, this might be done in an efficient way.

Abstract: Systems and methods for thermoelectric refrigerated/frozen product storage and transportation are provided. In some embodiments, a cooler includes active thermoelectric cooling to maintain internal temperature within cold chain or customer requirements. The active cooler can be used for storage and transportation of refrigerated and frozen food stuffs, medical or biological products, etc. The active cooler maintains stable and uniform temperature control. In some embodiments, a drop in module (e.g., removable/replaceable) can convert any insulated box to active cooling. This can be a commercial transport tote that provides high efficiency. The control logic can be enabled as an API to offer remote monitoring/control to utilize on board, wireless, and networked. A use profile can be customized, and a subscription software package can enable this. The solutions described herein can be used across the whole commercial spectrum and can be ready to integrate into large quantity fleet systems.

Abstract: A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.

Abstract: A hybrid Vapor Compression (VC) and Thermoelectric (TE) heat transport system is provided that maintains a set point temperature range of a chamber and includes a VC system and a TE system. The VC system includes a compressor, a condenser-evaporator connected to the compressor, a first valve connecting the compressor to an evaporator-condenser, and a second valve connecting the evaporator-condenser to a thermal expansion valve. The TE system includes TE modules, a first heat exchanger thermally connected with a first side of the TE modules which connects the first valve and the second valve, and a second heat exchanger thermally connected with a second side of the TE modules which connects the first valve and the second valve. In this way, the VC system and the TE system can be operated individually, in series, or in parallel to increase the efficiency of the hybrid VC and TE heat transport system.

Abstract: A micro-climate control system includes a thermoelectric system integrated with a fan assembly. The thermoelectric system is operable to actively cool or heat air as the air passes through the fan assembly. The thermoelectric system includes a thermoelectric heat pump, a heat reject subsystem, and a heat accept subsystem. The fan assembly is operable to draw air from a space to be conditioned and output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned and output air passed through the other away from the space to be conditioned. In this way, the micro-climate control system may provide localized comfort, while allowing a larger climate control system to maintain a more efficient temperature set point. In this way, the overall energy consumption may be reduced while providing the same level of effective comfort.

Abstract: A thermoelectric heat pump cascade and a method of manufacturing such are disclosed herein. In some embodiments, a thermoelectric heat pump cascade includes a first stage plurality of thermoelectric devices attached to a first stage circuit board and a first stage thermal interface material between the thermoelectric devices and the heat spreading lid over the thermoelectric devices. The thermoelectric heat pump cascade component also includes a second stage plurality of thermoelectric devices attached to a second stage circuit board where the second stage plurality of thermoelectric devices has a greater heat pumping capacity than the first stage plurality of thermoelectric devices, and a second stage thermal interface material between the second stage plurality of thermoelectric devices and the first stage plurality of thermoelectric devices.

Abstract: A metal core thermoelectric device and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric heat exchanger component includes a metal core circuit board and thermoelectric legs that are attached to the metal core circuit board. A top header is attached to the thermoelectric legs opposite the metal core circuit board. A top heat spreading lid is thermally connected to the top header. In this way, the thermoelectric heat exchanger component does not need the bottom header, bottom side thermal interface material, bottom side attach material, and/or bottom heat spreading lid. This may result in a significant reduction in materials and/or the processing steps required to create the thermoelectric heat exchanger component being greatly simplified. In some embodiments, at least some steps of the manufacturing may use standard surface mount technology equipment.

Abstract: A micro-climate control system includes a thermoelectric system integrated with a fan assembly. The thermoelectric system is operable to actively cool or heat air as the air passes through the fan assembly. The thermoelectric system includes a thermoelectric heat pump, a heat reject subsystem, and a heat accept subsystem. The fan assembly is operable to draw air from a space to be conditioned and output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned and output air passed through the other away from the space to be conditioned. In this way, the micro-climate control system may provide localized comfort, while allowing a larger climate control system to maintain a more efficient temperature set point. In this way, the overall energy consumption may be reduced while providing the same level of effective comfort.

Abstract: A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.

Abstract: A hybrid Vapor Compression (VC) and Thermoelectric (TE) heat transport system is provided that maintains a set point temperature range of a chamber and includes a VC system and a TE system. The VC system includes a compressor, a condenser-evaporator connected to the compressor, a first valve connecting the compressor to an evaporator-condenser, and a second valve connecting the evaporator-condenser to a thermal expansion valve. The TE system includes TE modules, a first heat exchanger thermally connected with a first side of the TE modules which connects the first valve and the second valve, and a second heat exchanger thermally connected with a second side of the TE modules which connects the first valve and the second valve. In this way, the VC system and the TE system can be operated individually, in series, or in parallel to increase the efficiency of the hybrid VC and TE heat transport system.

Abstract: According to one aspect, a hybrid heat transfer system includes a first thermally conductive path configured to passively transfer heat between a load having a load temperature (TL) and an ambient environment having an ambient temperature (TA), and a second thermally conductive path configured to actively transfer heat between the load and the ambient environment, the second path comprising a heat pump.

Abstract: Embodiments described herein include a cascade Thermoelectric Module (TEM) that includes at least three headers. A first header and a first surface of a second header electrically connect first legs to form a stage of thermoelectric devices electrically connected in series, and define first and second leg placement positions for a subset of the first legs. A second surface of the second header and a third header electrically connect second legs to form another stage of thermoelectric devices electrically connected in series, and define first and second leg placement positions for a subset of the second legs. The stages are electrically coupled in series when the subsets of the first and second legs are positioned in their respective first leg placement positions, and the stages are electrically decoupled when the subsets of the first and second legs are positioned in their respective second leg placement positions.

Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.

Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.