Abstract: An integrated circuit assembly includes an integrated circuit die having a first face, a second face and a perimeter. The second face bears a plurality of electrical contacts. A substrate is coupled to the die and has a first surface and a second surface facing in a different direction from the first surface. The substrate has a plurality of layers between the first and the second surfaces, at least some of the layers having one or more electrical traces. A compartment extends from the second surface through a plurality of the layers and has surfaces defining an inner chamber including a device interface surface. A plurality of electrically conductive vias extend through a plurality of the layers and at least two non-intersecting vias extend from the first surface and are coupled to electrical contacts of the substrate and to the device interface surface.