Patents by Inventor Diasuke Imanari

Diasuke Imanari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming hollow foam moldings
    Patent number: 8535598
    Abstract: A method for producing a hollow foam molding having a thin and uniform wall thickness, including extruding a foamable melt containing a polypropylene resin having an equilibrium compliance Jeo of 0.5×10?3 to 1.8×10?3 Pa?1 and a swell ratio Sw of 2.5 or less and a physical blowing agent through a die to obtain a parison having a softened polypropylene resin foam layer, placing the parison in a mold, and blowing a gas into the parison to obtain a hollow foam molding having a hardened polypropylene resin foam layer with an apparent density of 0.35 to 0.65 g/cm3.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: September 17, 2013
    Assignee: JSP Corporation
    Inventors: Diasuke Imanari, Kenichi Takase, Masayasu Okuda, Masato Naito
  • Hollow foam molding and production method therefor
    Publication number: 20070031622
    Abstract: A method for producing a hollow foam molding having a thin and uniform wall thickness, including extruding a foamable melt containing a polypropylene resin having an equilibrium compliance Jeo of 0.5×10?3 to 1.8×10?3 Pa?1 and a swell ratio Sw of 2.5 or less and a physical blowing agent through a die to obtain a parison having a softened polypropylene resin foam layer, placing the parison in a mold, and blowing a gas into the parison to obtain a hollow foam molding having a hardened polypropylene resin foam layer with an apparent density of 0.35 to 0.65 g/cm3.
    Type: Application
    Filed: July 18, 2006
    Publication date: February 8, 2007
    Applicant: JSP Corporation
    Inventors: Diasuke Imanari, Kenichi Takase, Masayasu Okuda, Masato Naito