Patents by Inventor Dick VERHAART

Dick VERHAART has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser fiber array for singulating semiconductor wafers
    Patent number: 10307867
    Abstract: An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: June 4, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Franz Hollinger, Karel Maykel Richard Van Der Stam, Dick Verhaart, Guido Martinus Henricus Knippels
  • LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS
    Publication number: 20160121426
    Abstract: An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.
    Type: Application
    Filed: November 5, 2014
    Publication date: May 5, 2016
    Inventors: Franz HOLLINGER, Karel Maykel Richard VAN DER STAM, Dick VERHAART, Guido Martinus Henricus KNIPPELS