Patents by Inventor Dickson THIAN

Dickson THIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Atomic layer deposition with passivation treatment
    Patent number: 11834741
    Abstract: A method includes: 1) performing an atomic layer deposition cycle including (a) introducing precursors into a deposition chamber housing a substrate to deposit a material on the substrate; and (b) introducing a passivation gas into the deposition chamber to passivate a surface of the material; and 2) repeating 1) a plurality of times to form a film of the material.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: December 5, 2023
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Friedrich B. Prinz, Shicheng Xu, Timothy English, John Provine, Dickson Thian, Jan Torgersen
  • ATOMIC LAYER DEPOSITION WITH PASSIVATION TREATMENT
    Publication number: 20190249301
    Abstract: A method includes: 1) performing an atomic layer deposition cycle including (a) introducing precursors into a deposition chamber housing a substrate to deposit a material on the substrate; and (b) introducing a passivation gas into the deposition chamber to passivate a surface of the material; and 2) repeating 1) a plurality of times to form a film of the material.
    Type: Application
    Filed: September 7, 2017
    Publication date: August 15, 2019
    Inventors: Friedrich B. PRINZ, Shicheng XU, Timothy ENGLISH, John PROVINE, Dickson THIAN, Jan TORGERSEN