Abstract: Methods for reducing resistivity of metal gapfill include depositing a conformal layer in an opening of a feature and on a field of a substrate with a first thickness of the conformal layer of approximately 10 microns or less, depositing a non-conformal metal layer directly on the conformal layer at a bottom of the opening and directly on the field using an anisotropic deposition process. A second thickness of the non-conformal metal layer on the field and on the bottom of the feature is approximately 30 microns or greater. And depositing a metal gapfill material in the opening of the feature and on the field where the metal gapfill material completely fills the opening without any voids.

Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.

Abstract: An apparatus and a method for laser beam shaping and scanning. The apparatus includes a digital micromirror device (DMD) including a plurality of micromirrors, configured to receive a first laser beam, adjust an axial position of a focal point of the first laser beam along a moving direction of the first laser beam by controlling a focal length of wavefront of a binary hologram applied to the DMD, and adjust a lateral position of the focal point on a plane perpendicular to the moving direction by controlling a tilted angle of a fringe pattern and a period of fringes of the binary hologram applied to the DMD, wherein the DMD simultaneously functions as programmable binary mask and a blazed grating.

Abstract: A laser fabrication method and a laser fabrication system. The laser fabrication system includes an ultrafast laser source configured to output a laser beam; and a digital micromirror device (DMD), configured to receive, shape, and scan the laser beam, wherein more than one binary holograms are synthesized to form a scanning hologram applied to the DMD. The shaped laser beam, containing one or multiple focal points, leaving the DMD, are focused to the sample for fast laser fabrication.

Abstract: An apparatus and a method for laser beam shaping and scanning. The apparatus includes a digital micromirror device (DMD) including a plurality of micromirrors, configured to receive a first laser beam, adjust an axial position of a focal point of the first laser beam along a moving direction of the first laser beam by controlling a focal length of wavefront of a binary hologram applied to the DMD, and adjust a lateral position of the focal point on a plane perpendicular to the moving direction by controlling a tilted angle of a fringe pattern and a period of fringes of the binary hologram applied to the DMD, wherein the DMD simultaneously functions as programmable binary mask and a blazed grating.

Abstract: A laser fabrication method and a laser fabrication system. The laser fabrication system includes an ultrafast laser source configured to output a laser beam; and a digital micromirror device (DMD), configured to receive, shape, and scan the laser beam, wherein more than one binary holograms are synthesized to form a scanning hologram applied to the DMD. The shaped laser beam, containing one or multiple focal points, leaving the DMD, are focused to the sample for fast laser fabrication.

Abstract: The present invention discloses methods and systems for fabricating a 3D metal structure. The method may comprises: forming one or more layers successively on a substrate, each of the layers comprising a structural material or a sacrificial material; laser machining, by a pulsed laser, each of the formed layers based on a photomask corresponding to the structure to be fabricated; and removing redundant materials from the formed layers to release the fabricated three-dimensional metal structure. The system and method for fabricating a 3D metal structure provided in the present application can fabricate a metal structure at nanometer level resolution with high throughout.