Patents by Inventor Dieter Hezler
Dieter Hezler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955315Abstract: A processing apparatus for processing a workpiece is presented. The processing apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. One or more radiative heat sources configured to heat the workpiece disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. The processing apparatus includes a rotation system configured to rotate the workpiece, the rotation system comprising a magnetic actuator.Type: GrantFiled: April 23, 2021Date of Patent: April 9, 2024Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.Inventors: Dieter Hezler, Keli Huang, Jianmin Ji, Deqiang Zeng, Manuel Sohn
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Publication number: 20240055242Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.Type: ApplicationFiled: October 25, 2023Publication date: February 15, 2024Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
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Patent number: 11837447Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.Type: GrantFiled: April 28, 2021Date of Patent: December 5, 2023Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
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Publication number: 20230352294Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.Type: ApplicationFiled: June 16, 2023Publication date: November 2, 2023Inventors: Michael X. Yang, Rolf Bremensdorfer, Dave Camm, Joseph Cibere, Dieter Hezler, Shawming Ma, Yun Yang
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Patent number: 11721539Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.Type: GrantFiled: November 23, 2021Date of Patent: August 8, 2023Assignees: BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD., MATTSON TECHNOLOGY, INCInventors: Michael X. Yang, Rolf Bremensdorfer, Dave Camm, Joseph Cibere, Dieter Hezler, Shawming Ma, Yun Yang
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Publication number: 20220205478Abstract: A workpiece support for a thermal processing system is provided. The workpiece support includes a rotor configured to support a workpiece. The workpiece support further includes a gas supply. The gas supply can include a plurality of bearing pads. Each of the bearing pads can be positioned closer to a periphery of the rotor than a center of the rotor. Each of the bearing define one or more passages configured to direct gas onto the rotor to control a position of the rotor along a first axis and a second axis that is substantially perpendicular to the first axis. Furthermore, one or more of the bearing pads define at least one additional passage configured to direct gas onto the rotor to control rotation of the rotor about the first axis.Type: ApplicationFiled: December 14, 2021Publication date: June 30, 2022Inventors: Manuel Sohn, Rolf Bremensdorfer, Dieter Hezler
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Publication number: 20220195601Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system, and radiative heat sources for heating the workpiece. The gas delivery system includes a gas showerhead assembly that is transparent to electromagnetic radiation emitted from the one or more radiative heat sources. The gas showerhead assembly includes one or more gas diffusion mechanisms to distribute gas within the enclosure.Type: ApplicationFiled: December 13, 2021Publication date: June 23, 2022Inventors: Michael Yang, Yun Yang, Manuel Sohn, Silke Hamm, Alex Wansidler, DIeter Hezler, Rolf Bremensdorfer
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Publication number: 20220189747Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.Type: ApplicationFiled: April 28, 2021Publication date: June 16, 2022Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
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Publication number: 20220187021Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.Type: ApplicationFiled: December 9, 2021Publication date: June 16, 2022Inventors: Manuel Sohn, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Martin Zucker, Pete Lembesis, Michael Yang
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Publication number: 20220189737Abstract: A processing apparatus for processing a workpiece is presented. The processing apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. One or more radiative heat sources configured to heat the workpiece disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. The processing apparatus includes a rotation system configured to rotate the workpiece, the rotation system comprising a magnetic actuator.Type: ApplicationFiled: April 23, 2021Publication date: June 16, 2022Inventors: Dieter Hezler, Keli Huang, Jianmin Ji, Deqiang Zeng, Manuel Sohn
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Publication number: 20220165561Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.Type: ApplicationFiled: November 23, 2021Publication date: May 26, 2022Inventors: Michael X. Yang, Rolf Bremensdorfer, Dave Camm, Joseph Cibere, Dieter Hezler, Shawming Ma, Yun Yang
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Publication number: 20220059371Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.Type: ApplicationFiled: August 18, 2021Publication date: February 24, 2022Inventors: Manuel Sohn, Rolf Bremensdorfer, Silke Hamm, Dieter Hezler
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Publication number: 20220059363Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.Type: ApplicationFiled: August 18, 2021Publication date: February 24, 2022Inventors: Manuel Sohn, Rolf Bremensdorfer, Dieter Hezler
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Patent number: 10359334Abstract: Systems and methods for detecting a fluid leak associated with fluid cooled components in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system can include a processing chamber having one or more fluid cooled components. The system can include a gas flow system configured to provide for the flow of process gas in the processing chamber. The system can include a vapor sensor configured to measure vapor in process gas flowing through the gas flow system for detecting a fluid leak associated with the one or more fluid cooled components.Type: GrantFiled: December 13, 2016Date of Patent: July 23, 2019Assignee: Mattson Technology, Inc.Inventors: Manuel Mueller, Dieter Hezler
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Publication number: 20170191897Abstract: Systems and methods for detecting a fluid leak associated with fluid cooled components in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system can include a processing chamber having one or more fluid cooled components. The system can include a gas flow system configured to provide for the flow of process gas in the processing chamber. The system can include a vapor sensor configured to measure vapor in process gas flowing through the gas flow system for detecting a fluid leak associated with the one or more fluid cooled components.Type: ApplicationFiled: December 13, 2016Publication date: July 6, 2017Inventors: Manuel Mueller, Dieter Hezler