Patents by Inventor Dieter J. Meier

Dieter J. Meier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to manufacture high-precision RFID straps and RFID antennas using a laser
    Patent number: 7510985
    Abstract: A method is described for the manufacture of structured flexible metallic patterns in which a metallic layer on a flexible substrate is structured using laser ablation. The flexible patterns manufactured in this fashion may be used as interposers (strap) for RFID tags or RFID antennas.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: March 31, 2009
    Assignee: LPKF Laser & Electronics AG
    Inventors: Andreas Boenke, Dieter J. Meier
  • Method for selectively metalizing dieletric materials
    Publication number: 20040026254
    Abstract: Method for selectively metallizing dielectric materials, the method includes: adhesively covering dielectric materials with an activating layer comprising a conductive material, which layer is subsequently structured by way of laser ablation; and using a subsequent laser treatment to structure the activating layer in such a way that discrete conductive structures are formed, which are subsequently metallized.
    Type: Application
    Filed: August 4, 2003
    Publication date: February 12, 2004
    Inventors: Jurgen Hupe, Walter Kronenberg, Jorg Kickelhain, Dieter J. Meier