Abstract: A method for the manufacture of electrically conductive lead-throughs for metallized plastic housings. Elevations around the lead-through holes in the housing part are formed at the time of making the housing part (e.g. by injection molding). The entire surface of the housing part is then metallized and the metallization on the elevations around the lead-through holes is removed by mechanical processes that act in one plane and where the lower metallization areas remain unaffected on account of the difference in level. Finally, the metal pins are attached in the lead-through holes by soldering or glueing.

Abstract: The invention relates to a CW-Nd:YAG Laser soldering system for SMD-components by means of which the soldering may be shortened by the simultaneous feeding of solder, multiple radiation, ER-absorber, flux or reaction gas, and an optimizing of the Z-adjustment of the laser spot or spots and the laser power per soldering point can be controlled. Embodiments are explained and are illustrated schematically in the figures of the drawing.