Abstract: A method and a casting mold for producing an optical semiconductor module is provided, wherein a semiconductor body having at least one optically active element on its top is introduced into a leadframe. Then conductive connections are established between the semiconductor body and the leadframe, and then the leadframe and semiconductor body are encapsulated in a casting mold. Wherein provided in the part of the casting mold that faces the top of the semiconductor body are masking bodies, which extend from the top inner wall of the casting mold towards the optically active elements and cover the elements with their respective end face in a way that seals out casting material.

Abstract: A fluid sensor is provided for determining a fluid characteristic, having an electronic sensor element that has an active surface for determining the fluid characteristic, having a mounting plate associated with the sensor element, and having a filter device associated with the sensor element for filtering the fluid, in which the active surface of the sensor element is oriented toward the mounting plate and in which the mounting plate is provided with an opening opposite from the active surface of the sensor element. According to an embodiment the invention, an end region of the filter device is accommodated in a sealed fashion in the opening of the mounting plate. Furthermore, the fluid sensor can be used for tire pressure measurement.

Abstract: A fluid sensor is provided for determining a fluid characteristic, having an electronic sensor element that has an active surface for determining the fluid characteristic, having a mounting plate associated with the sensor element, and having a filter device associated with the sensor element for filtering the fluid, in which the active surface of the sensor element is oriented toward the mounting plate and in which the mounting plate is provided with an opening opposite from the active surface of the sensor element. According to an embodiment the invention, an end region of the filter device is accommodated in a sealed fashion in the opening of the mounting plate. Furthermore, the fluid sensor can be used for tire pressure measurement.

Abstract: An electronic subassembly is provided that includes at least one integrated circuit which is housed in a dimensionally stable plastic package and which is connected in an electrically conductive manner to at least one externally accessible, electrically conductive contact prong on the plastic package. An electronic assembly is also provided with such an electronic subassembly, and a method for producing an electronic assembly. According to the invention, provision is made for at least one recess to be provided in the plastic package, designed in particular as an indentation, in which at least one contact prong is arranged such that it is exposed.

Abstract: In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a suitable time by providing an end point signal detection due to the laser beam impinging on a protective layer. Thereby, after opening the housing, electrical measurements can be carried out on the electronic module.

Abstract: A method and a casting mold for producing an optical semiconductor module is provided, wherein a semiconductor body having at least one optically active element on its top is introduced into a leadframe. Then conductive connections are established between the semiconductor body and the leadframe, and then the leadframe and semiconductor body are encapsulated in a casting mold. Wherein provided in the part of the casting mold that faces the top of the semiconductor body are masking bodies, which extend from the top inner wall of the casting mold towards the optically active elements and cover the elements with their respective end face in a way that seals out casting material.

Abstract: Method a method for the opening of a plastic-housed electronic module. Previously, the electronic module can be only inadequately protected during the opening of the plastic housing, so that the electronic module is damaged during the opening. According to the new method, during the opening of the housing by a laser, the electronic module is protected from the effects of the laser beam by means of an end point signal detection and a protective layer. Thereby, after the opening of the housing, electrical measurements can be carried out on the electronic module.

Abstract: The invention relates to an optical system comprising a semiconductor laser and an optical instrument collimating the laser light. In accordance with the invention, the semiconductor laser and the optical instrument are accommodated in separate holders which are adjusted relative to one another in such a way that a criterion relating to the laser light is optimally fulfilled. After completion of the adjustment, the two holders, both forming the external housing of the entire system, are joined to one another.

Abstract: An integrated circuit arrangement comprises a semiconductor body carrying an integrated circuit which is embedded in an insulating material casing together with a plurality of flat strip lines for making electrical connection with the semiconductor body, and a layer of electrically conductive material in or on the casing in a plane substantially parallel to the flat strip lines only on the side of the semiconductor body in which the construction elements forming the integrated circuit are located.