Abstract: A circular cutting unit for partially cutting one or more layers of a cable or wire along a cutting plane. The circular cutting unit include a knife head including a drive disc and an adjustment disc that are each rotatable about a disc axis. A pair of knife holders that each include a knife blade are pivotally mounted to the drive disc. Relative rotation of the adjustment disc relative to the drive disc causes the knife holders to pivot causing movement of the knife blades toward or away from each other. The circular cutting unit includes a primary drive assembly and an adjustment drive assembly that are each separately operable. The primary drive assembly rotates the knife head at the cutting speed and the adjustment drive assembly rotates the adjustment disc relative to the drive disc.

Abstract: A circular cutting unit for partially cutting one or more layers of a cable or wire along a cutting plane. The circular cutting unit include a knife head including a drive disc and an adjustment disc that are each rotatable about a disc axis. A pair of knife holders that each include a knife blade are pivotally mounted to the drive disc. Relative rotation of the adjustment disc relative to the drive disc causes the knife holders to pivot causing movement of the knife blades toward or away from each other. The circular cutting unit includes a primary drive assembly and an adjustment drive assembly that are each separately operable. The primary drive assembly rotates the knife head at the cutting speed and the adjustment drive assembly rotates the adjustment disc relative to the drive disc.

Abstract: A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Abstract: A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Abstract: The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a Pick and Place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the Pick and Place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Abstract: The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a Pick and Place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The Pick and Place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: Multidigit counting wheel mechanism for a volume-measuring instrument. An absolute encoder for a measuring instrument includes a mechanical counting wheel mechanism consisting of five sensors, mounted in a plane perpendicular to a counting mechanism axle, for each counting wheel and a code, producing a digital rotary angle signal with a resolution of 12.degree., on each counting wheel, with the counting wheel mechanism being visually readable in a conventional manner, with the encoder not increasing the torque required for driving the counting mechanism.