Patents by Inventor Dietolf Seippel

Dietolf Seippel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8324028
    Abstract: An assembly includes a support element and a chip having contact elements. The chip is mounted onto the support element with the contact elements facing the support element. A shield layer is on the support element for electrically or magnetically shielding a circuit element of the chip.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: December 4, 2012
    Assignee: Infineon Technologies AG
    Inventors: Jens Kissing, Dietolf Seippel
  • Patent number: 8053890
    Abstract: An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: November 8, 2011
    Assignee: Infineon Technologies AG
    Inventors: Giuseppe Li Puma, Dietolf Seippel
  • Patent number: 7751513
    Abstract: A first signal path having an amplifier and a second signal path having an amplifier with adjustable gain factor are provided. A signal applied to the first and second signal paths is amplified and demodulated on the first signal path. Concurrently, the signal is amplified on the second signal path with a gain factor, and a power of the signal amplified by the second signal path is determined and used for determining the gain factor. A signal conditioning circuit has first and second signal paths and a first and a second operating state. In the first operating state, the first signal path is arranged for amplification for a demodulation, and the second signal path is arranged for amplification for determination of a power of the signal present. In the second operating state, one of the two signal paths is inactive and the other is arranged for demodulating the signal present.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: July 6, 2010
    Assignee: Infineon Technologies AG
    Inventors: Carsten Eisenhut, Jens Kissing, Giuseppe Li Puma, Dietolf Seippel, Nenad Stevanovic
  • Patent number: 7433667
    Abstract: A signal conditioning circuit contains an oscillator which is connected to the inputs of two mixers. The output of one mixer is coupled, so as to form a feedback path, to a frequency divider circuit whose first output is coupled to the second input of the first mixer. A second signal output of the frequency divider circuit carries a signal with a phase shift of 90 degrees with respect to the signal at the first signal output of the frequency divider circuit. The second signal is supplied to a second input of the second mixer. Feedback results in undesirable signal components in the in-phase and quadrature components being suppressed. At the same time, the in-phase and quadrature components have a fixed phase relationship with respect to one another. The signal conditioning circuit allows desired non-integer division ratios to be achieved.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 7, 2008
    Assignee: Infineon Technologies AG
    Inventors: Dietolf Seippel, André Hanke, Duyen Pham-Stäbner
  • Publication number: 20080129394
    Abstract: An assembly includes a support element and a chip having contact elements. The chip is mounted onto the support element with the contact elements facing the support element. A shield layer is on the support element for electrically or magnetically shielding a circuit element of the chip.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Inventors: Jens Kissing, Dietolf Seippel
  • Publication number: 20080130257
    Abstract: An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.
    Type: Application
    Filed: December 19, 2006
    Publication date: June 5, 2008
    Inventors: Giuseppe Li Puma, Dietolf Seippel
  • Patent number: 7239854
    Abstract: One or more aspects of the present invention are directed to a frequency-doubling circuit arrangement that doubles the frequency of a signal applied to its input, and presents that doubled frequency signal at its output. A rectifier that rectifies the input signal as a function of a reference variable is provided for coupling the input and output. A regulator is used to supply the reference variable to a control input of the rectifier. A control loop is designed so that even-numbered higher harmonics in the output signal disappear or are greatly suppressed. Since the frequency-doubling circuit described has a low power consumption in conjunction with a smaller chip area, it is particularly suitable for installation in mobile radios for conditioning carrier frequencies and local oscillator frequencies.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: July 3, 2007
    Assignee: Infineon Technologies AG
    Inventors: Christian Grewing, André Hanke, Dietolf Seippel
  • Publication number: 20070116160
    Abstract: A first signal path having an amplifier and a second signal path having an amplifier with adjustable gain factor are provided. A signal applied to the first and second signal paths is amplified and demodulated on the first signal path. Concurrently, the signal is amplified on the second signal path with a gain factor, and a power of the signal amplified by the second signal path is determined and used for determining the gain factor. A signal conditioning circuit has first and second signal paths and a first and a second operating state. In the first operating state, the first signal path is arranged for amplification for a demodulation, and the second signal path is arranged for amplification for determination of a power of the signal present. In the second operating state, one of the two signal paths is inactive and the other is arranged for demodulating the signal present.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 24, 2007
    Inventors: Carsten Eisenhut, Jens Kissing, Giuseppe Puma, Dietolf Seippel, Nenad Stevanovic
  • Publication number: 20060017602
    Abstract: The mobile radio receiver comprises a variable amplifier (3), a first means (9, 10) for comparison of a signal, which is characteristic of the amplitude of a received signal, with at least one analogue comparison value (PDTHR), a second means (13, 14, 17) for comparison of a signal, which is characteristic of the amplitude of a received signal, with at least one digital comparison value (RSSITHR), and a third means (17, 11) for setting the gain, which is driven by the first means (9, 10) and by the second means (13, 14, 17).
    Type: Application
    Filed: July 21, 2005
    Publication date: January 26, 2006
    Inventors: Giuseppe Puma, Duyen Pham-Stabner, Dietolf Seippel
  • Publication number: 20050113056
    Abstract: A signal conditioning circuit contains an oscillator which is connected to the inputs of two mixers. The output of one mixer is coupled, so as to form a feedback path, to a frequency divider circuit whose first output is coupled to the second input of the first mixer. A second signal output of the frequency divider circuit carries a signal with a phase shift of 90 degrees with respect to the signal at the first signal output of the frequency divider circuit. The second signal is supplied to a second input of the second mixer. Feedback results in undesirable signal components in the in-phase and quadrature components being suppressed. At the same time, the in-phase and quadrature components have a fixed phase relationship with respect to one another. The signal conditioning circuit allows desired non-integer division ratios to be achieved.
    Type: Application
    Filed: September 23, 2004
    Publication date: May 26, 2005
    Inventors: Dietolf Seippel, Andre Hanke, Duyen Pham-Stabner
  • Publication number: 20050090220
    Abstract: One or more aspects of the present invention are directed to a frequency-doubling circuit arrangement that doubles the frequency of a signal applied to its input, and presents that doubled frequency signal at its output. A rectifier that rectifies the input signal as a function of a reference variable is provided for coupling the input and output. A regulator is used to supply the reference variable to a control input of the rectifier. A control loop is designed so that even-numbered higher harmonics in the output signal disappear or are greatly suppressed. Since the frequency-doubling circuit described has a low power consumption in conjunction with a smaller chip area, it is particularly suitable for installation in mobile radios for conditioning carrier frequencies and local oscillator frequencies.
    Type: Application
    Filed: September 14, 2004
    Publication date: April 28, 2005
    Inventors: Christian Grewing, Andre Hanke, Dietolf Seippel