Abstract: An electronic device may include hardware and software configured to detect device failures in the electronic device and log a device error code for detected device failures. Device error codes may be electronically communicated over a communications link to a system external to the electronic device. A client device (e.g., a smartphone, tablet, pad, or PC) may be linked with the electronic device and may be configured to receive the communicated device error codes. The client device may be operative to communicate the received device error codes to another system (e.g., a backend system). The electronic device may link with the backend system and communicate the device error codes to the backend system. Networked computing resources in communication with the backend system may analyze the received error codes to determine whether or not to communicate a device replacement notice. A customer profile may be used as part of the analysis.

Abstract: A housing (e.g., a wearable structure) includes one or more sensors operative to capture sensor data and a plug operative to electrically communicate data (e.g., the sensor data) to another device via a hard wired connection. A wirelessly enabled cap may be removably coupled with the housing and may include: a cavity operative to house the plug; a RF chip disposed within the housing; and one or more antennas electrically coupled with the chip. The chip is operative to wirelessly communicate data (e.g., the sensor data) in accordance with one or more wireless communication protocols (e.g., short-range, long-range, near field). The one or more antennas may form an exterior portion(s) of the housing and/or may be embedded in a portion(s) of the housing. The chip may be passive powered from an external RF source (e.g., an externally generated RF signal electrically coupled with the chip through one or more antennas).

Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, conductive structures for a flexible substrate, a component coupled to the flexible substrate, and/or a wearable device. In one example, a wearable device includes a framework configured to be worn or attached, and a flexible substrate coupled to the framework. In some examples, the flexible substrate may have a first end and a second end, and may include one or more resilient conductive structures, and one or more rigid regions configured to receive one or more components including a sensor, or, for example, electrodes for a bioimpedance sensor.

Abstract: A housing (e.g., a wearable structure) includes one or more sensors operative to capture sensor data and a plug operative to electrically communicate data (e.g., the sensor data) to another device via a hard wired connection. A wirelessly enabled cap may be removably coupled with the housing and may include: a cavity operative to house the plug; a RF chip disposed within the housing; and one or more antennas electrically coupled with the chip. The chip is operative to wirelessly communicate data (e.g., the sensor data) in accordance with one or more wireless communication protocols (e.g., short-range, long-range, near field). The one or more antennas may form an exterior portion(s) of the housing and/or may be embedded in a portion(s) of the housing. The chip may be passive powered from an external RF source (e.g., an externally generated RF signal electrically coupled with the chip through one or more antennas).

Abstract: A data-capable band including a wirelessly enabled housing may include a sensor operative to capture sensor data, a plug coupled with the band and operative to send the sensor data to another device having a structure configured to receive the plug, the housing operative to be removeably coupled with the band and including a cavity operative to house the plug, and a microchip disposed within the housing and operative to electrically communicate stored data in accordance with a short-range communication standard (e.g., one or more wireless communication standards and/or protocols). The housing may comprise a cap or cap-like structure. The housing may include an antenna electrically coupled with the microchip. The microchip may be passive and may include circuitry to passively receive electrical power from an external source other than circuitry in the band (e.g., an externally generated RF signal electrically coupled with the microchip through one or more antennas).

Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices configured to facilitate communication among electronic devices, including mobile phones and media devices that present audio and/or video content. More specifically, disclosed are wearable systems, platforms and methods for providing stress-tolerant interconnections to enhance signal connectivity reliability in a wearable device. In various embodiments, a wearable electronics platform can include circuit substrates and interconnect portions disposed coextensive with a longitudinal surface between the circuit substrates. An interconnection portion can include conductors having one or more stress-relief features, and an elastic material encapsulating the conductors. In some examples, the longitudinal surface including the interconnects and the circuit substrates can be configured to substantially encircle an axis.

Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, aligning a flexible substrate and/or components thereof during fabrication to enhance reliability. In one example, a method includes forming a framework that includes, for example, a portion (e.g., an anchor portion) configured to couple to a flexible substrate, the portion having a neutral axis. Also, the method may include forming a flexible substrate that includes a supported flex region including conductors and one or more rigid regions configured to receive one or more components. A rigid region might include an encapsulated rigid region. The method further may also include aligning the encapsulated rigid region at an angle to the neutral axis, and molding over the encapsulated rigid region.

Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, a flexible substrate. In one example, a wearable device may include a framework configured to be worn or attached, and a flexible substrate coupled to the framework. The flexible substrate may include a first end and a second end, and may include one or more conductive layer structures and a conductive laminate structure. The flexible substrate may include rigid regions configured to receive one or more components including a sensor, an electrode, and/or a logic circuit (e.g., bioimpedance logic circuit).

Abstract: Embodiments of the present application relate generally to personal electronics, portable electronics, wearable electronics, and more specifically to a structure and method for a protective covering for a wearable device. Interior and exterior structures of the wearable device are configured to be flexed into a configuration and to retain the configuration after the flexing. Interior structure may include a first flexible substrate having a first relaxation structure and a second flexible substrate having a second relaxation structure. Components or other structures may be connected with the first and/or second flexible substrates. The first and second relaxation structures may be positioned relative to each other to define a flexure point. At least one flexible and electrically non-conductive cover, that may undergo shirking, may conformally cover at least a portion of the interior structure. A flexible overmolding may be formed over the cover and may comprise the exterior structure.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.

Abstract: A method of forming an optical device having secondary surface features thereon includes disposing a photopolymerizable material between a first substrate and a second substrate such that a rear surface of the photopolymerizable material contacts the first substrate and a front surface of the photopolymerizable material contacts the second substrate, the first substrate being a compliant substrate; and irradiating the photopolymerizable material from the front surface thereof using collimated light so as to induce at least partial polymerization of the photopolymerizable material, wherein the secondary surface features are formed at the rear surface of the photopolymerizable material.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.