Abstract: The present invention provides a system and method for concurrently performing analysis and optimization of an integrated circuit (IC) design in multiple scenarios. The system is based on a distributed computing model, where any optimization change introduced in one scenario is immediately tested in all other scenarios. This ensures that modifications made to the design do not affect other scenarios. The invention significantly reduces the execution time of the optimization and signoff flows in the design of ICs. In addition, the computing means required for simultaneously testing multiple scenarios are standard and affordable.

Abstract: Methods for routing in the design of integrated circuits (ICs) to simplify the routing task. The method includes dividing a given IC design into a limited number of non-overlapping tiles, and then routing all tiles in parallel, each tile being independently routed by a standard router. Thereafter, routed tiles are assembled to form a routing solution for the entire IC. Details of exemplary methods are disclosed.

Abstract: Methods for routing in the design of integrated circuits (ICs) to simplify the routing task. The method includes dividing a given IC design into a limited number of non-overlapping tiles, and then routing all tiles in parallel, each tile being independently routed by a standard router. Thereafter, routed tiles are assembled to form a routing solution for the entire IC. Details of exemplary methods are disclosed.

Abstract: The present invention provides a system and method for accelerating the resistance and capacitance (RC) extraction process by performing parallel and distributed processing. The method includes the dividing of a given integrated circuit (IC) design into a limited number of non-overlapping tile blocks, distributing tile blocks to standard RC extraction tools, and processing all tiles in parallel by these tools. A tile block includes all information for performing accurate RC extraction. Thereafter, resulting parasitic RC information is assembled to form a complete parasitic RC model for the entire IC.