Abstract: A novel tray assembly for a rack mount type storage unit is provided. The tray assembly is adapted to receive an enclosure. When within the tray assembly, the enclosure may be located within a first position, a second position or a third position. When in the first position, the enclosure is fully received within the tray assembly and the tray assembly is fully received within the rack and is operational. When in the second position, the tray assembly is fully received within the rack and the enclosure is partially slid out of the tray assembly and rack for maintenance, repair, etc. while the enclosure is still powered and running. When in the third position, the enclosure is fully received within the tray assembly for easy insertion into or removal from a rack.

Abstract: An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.

Abstract: A computer assembly includes a motherboard having a first bus extending to a first connector and a riser card having a second bus extending to a plurality of connectors and extending to a second connector adapted to mate with the first contact set of the motherboard to couple the first bus with the second bus. The computer assembly further includes a first expansion card having a third bus extending to a third connector adapted to mate with one of the plurality of connectors of the riser card to couple the third bus with the second bus. A method includes driving a first signal onto a motherboard bus, transmitting the first signal over the motherboard bus to a riser card bus, and transmitting the first signal over the riser card bus to a plurality of expansion card buses.

Abstract: A smart card reader assembly includes a printed circuit board having a bus, a smart card reader interconnected with the bus of the printed circuit board, and a connector interconnected with the bus of the printed circuit board. The smart card reader is capable of reading data from a smart card and is capable of transmitting signals representing the data to the bus of the printed circuit board. Further, the smart card reader assembly is capable of being oriented so that the smart card may be inserted into the smart card reader in an upright orientation.

Abstract: An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.

Abstract: A bezel assembly for a computer enclosure includes a bezel and a hinge capable of hingedly joining the bezel to the computer enclosure. A computer system includes an enclosure, a bezel, and a hinge capable of hingedly joining the bezel to the enclosure. A method of replacing a first component with a second component in a computer system enclosure having a hinged bezel includes pivoting the hinged bezel away from the computer system enclosure and removing the first component from the computer system enclosure. The method further includes inserting the second component into the computer system enclosure and pivoting the hinged bezel toward the computer system such that the hinged bezel is adjacent the computer system enclosure.

Abstract: The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.

Abstract: A fan assembly with a single fan housing that has at least one fan passage adapted to allow air to flow through the housing. A separate fan subassembly is snapped into a motor housing formed within the passages of the fan housing. The subassembly includes an electric motor that rotates an impeller. The rotation of the impeller creates an airflow through the air passage. Attached to the surface of the housing is a conductor that extends from the motor, to an electrical connector that supplies power to the motor from an external power source. The air passage has rounded entrances and is formed such that the passage is shaped like a venturi tube. The rounded edges reduce the head loss through the passage by an order of magnitude, decreasing the pressure drop across the housing and improving the overall efficiency of the fan.