Patents by Inventor Dinesh R. Rakwal

Dinesh R. Rakwal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10837487
    Abstract: A bearing assembly is disclosed. The bearing assembly includes a first race. Further, the bearing assembly includes a second race disposed concentric to the first race, where the second race has a radius that changes along an axial length of the bearing assembly. The bearing assembly also includes a housing disposed around the second race and operatively coupled to the second race. Moreover, the bearing assembly includes a plurality of support structures configured to detachably couple the second race to the housing, where the plurality of support structures are configured to disengage the second race from the housing to allow motion of the second race when a torque on the second race is greater than a threshold torque value.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: November 17, 2020
    Assignee: Transportation IP Holdings, LLC
    Inventors: Mandyam Rangayan Sridhar, Ravindra Shankar Ganiger, Dinesh R. Rakwal, Ajith Kuttannair Kumar, Bret Dwayne Worden
  • Publication number: 20190301526
    Abstract: A bearing assembly is disclosed. The bearing assembly includes a first race. Further, the bearing assembly includes a second race disposed concentric to the first race, where the second race has a radius that changes along an axial length of the bearing assembly. The bearing assembly also includes a housing disposed around the second race and operatively coupled to the second race. Moreover, the bearing assembly includes a plurality of support structures configured to detachably couple the second race to the housing, where the plurality of support structures are configured to disengage the second race from the housing to allow motion of the second race when a torque on the second race is greater than a threshold torque value.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 3, 2019
    Inventors: Mandyam Rangayan Sridhar, Ravindra Shankar Ganiger, Dinesh R. Rakwal, Ajith Kuttannair Kumar, Bret Dwayne Worden
  • Patent number: 9303330
    Abstract: The present disclosure relates to methods for manufacturing porous mesh plates for use in ultrasonic mesh nebulizers, and the porous mesh plates manufactured by those methods. Cone-shaped dimples are first drilled in a substrate (e.g. a plate), but do not penetrate the bottom of the substrate. Next, the substrate (e.g. a plate) is subject to an electrochemical process to remove a layer of material from the surface of the substrate. Enough material is removed to allow the dimples to penetrate the substrate, thereby creating holes in the substrate. The size of the holes can be controlled by the conditions of the electrochemical process.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: April 5, 2016
    Assignee: General Electric Company
    Inventors: Guruprasad Sundararajan, Marko Klaus Baller, Swarnagowri Addepalli, Satyanarayanan Seshadri, Dinesh R. Rakwal, Subhashish Dasgupta, Heikki Haveri
  • Publication number: 20140360886
    Abstract: The present disclosure relates to methods for manufacturing porous mesh plates for use in ultrasonic mesh nebulizers, and the porous mesh plates manufactured by those methods. Cone-shaped dimples are first drilled in a substrate (e.g. a plate), but do not penetrate the bottom of the substrate. Next, the substrate (e.g. a plate) is subject to an electrochemical process to remove a layer of material from the surface of the substrate. Enough material is removed to allow the dimples to penetrate the substrate, thereby creating holes in the substrate. The size of the holes can be controlled by the conditions of the electrochemical process.
    Type: Application
    Filed: June 7, 2013
    Publication date: December 11, 2014
    Inventors: Guruprasad Sundararajan, Marko Klaus Baller, Swarnagowri Addepalli, Satyanarayanan Seshadri, Dinesh R. Rakwal, Subhashish Dasgupta, Heikki Haveri
  • Publication number: 20100199909
    Abstract: Methods of recycling excess semiconductor material removed from an unshaped semiconductor boule are disclosed. Excess semiconductor material is cut from an semiconductor unshaped boule thereby generating a shaped semiconductor boule. The excess semiconductor material is removed in the form of large pieces that can easily be cleaned and retrieved for reuse.
    Type: Application
    Filed: January 25, 2008
    Publication date: August 12, 2010
    Applicant: University of Utah Research Foundation
    Inventors: Eberhard Bamberg, Dinesh R. Rakwal, Dean Jorgensen, Ian R. Harvey, Michael L. Free, Alagar K. Balaji
  • Publication number: 20100187203
    Abstract: A multi-wire electron discharge machine includes a first wire electrode for creating an electrical discharge between the first electrode wire and a semiconductor ingot, a second wire electrode for creating an electrical discharge between the second electrode wire and the semiconductor ingot, and a wire guide for maintaining the first wire electrode in a spaced apart and generally parallel orientation with respect to the second wire electrode across a semiconductor ingot slicing area.
    Type: Application
    Filed: January 25, 2008
    Publication date: July 29, 2010
    Applicant: University of Utah Research Foundation
    Inventors: Eberhard Bamberg, Dinesh R. Rakwal