Patents by Inventor Dinesh Rajamanickam

Dinesh Rajamanickam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096687
    Abstract: A module of a processing system for flipping a substrate in vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Harish V PENMETHSA, Suresh PALANISAMY, Dinesh RAJAMANICKAM, Naresh Kumar ASOKAN
  • Patent number: 11881427
    Abstract: A module of a processing system for flipping a substrate in vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 23, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Harish Penmethsa, Suresh Palanisamy, Dinesh Rajamanickam, Naresh Kumar Asokan
  • Publication number: 20230103481
    Abstract: Apparatus and methods for flipping substrates in vacuum between PVD sputtering of each side for increasing throughput are provided herein. In some embodiments disclosed herein, a module of a processing system for flipping a substrate in vacuum is provided. The module includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.
    Type: Application
    Filed: October 4, 2021
    Publication date: April 6, 2023
    Inventors: Harish Penmethsa, Suresh Palanisamy, Dinesh Rajamanickam, Asokan Naresh Kumar