Abstract: An integrated circuit package may include a semiconductor die on a first side of the integrated circuit package, a first ball grid array (BGA) connection on the first side of the integrated circuit package, and a second BGA connection on a second side of the integrated circuit package. The integrated circuit package may include one or more traces that route data from the first BGA connection and the second BGA connection.

Abstract: In accordance with embodiments disclosed herein, there is provided systems and methods for low latency statistical data bus inversion (DBI) for energy reduction. A transmitting component includes a transmitter and a statistical DBI circuit. The statistical DBI circuit is to receive current data to be transmitted on a data bus and is to store previous data transmitted on the data bus. The statistical DBI circuit includes inverting logic to invert bits of the current data before transmission in response to a control signal. The statistical DBI circuit includes adjacent pattern prediction logic to receive a difference vector including a comparison of the previous data and the current data, determine whether the difference vector includes a pattern predicting transmission of the current data with toggle is more efficient than without toggle, and output the control signal in the first state indicating the pattern was detected.

Abstract: In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.

Abstract: Described is an apparatus for power management. The apparatus comprises: a first power supply node; a second power supply node; a controllable device coupled to the first power supply node and to the second power supply node, the controllable device operable to short the first power supply node to the second power supply node; a load coupled to the second power supply node; and a charge recovery pump (CRP) coupled to the first and second power supply nodes.

Abstract: Described is an apparatus which comprises: a first oscillator to generate a first clock signal a second oscillator to generate a second clock signal; a phase frequency detector to detect phase difference between the first and second clock signals, and to generate a phase difference; and an output stage, coupled to a load, to generate a power supply for the load according to the phase difference.

Abstract: Embodiments are generally directed to a low-overhead mechanism to detect address faults in ECC-protected memories. An embodiment of an apparatus includes a memory array; an error correction code (ECC) encoder for the memory array to encode ECC values based on a data value and a respective address value for the data value; and an ECC decoder for the memory array to decode ECC values that are based on data values and respective addresses for the data values; wherein the apparatus is to detect and correct an error in an address value based on an ECC value, address value, and data value stored in the memory.

Abstract: Described is an apparatus which comprises: a first die including: a processing core; a crossbar switch coupled to the processing core; and a first edge interface coupled to the crossbar switch; and a second die including: a first edge interface positioned at a periphery of the second die and coupled to the first edge interface of the first die, wherein the first edge interface of the first die and the first edge interface of the second die are positioned across each other; a clock synchronization circuit coupled to the second edge interface; and a memory interface coupled to the clock synchronization circuit.

Abstract: Technology for an apparatus is described. The apparatus can include a memory controller with circuitry configured to read K bits of M bits of encoded data in memory, D error detection bits, and P Parity bits protecting the M bits of encoded data for performing a read-write-modify (RWM) command operation on the K bits of the M bits encoded data, wherein K, M and D are positive integers and P is a vector of a set of parity bits. The memory controller can determine whether an error is present on the K bits of the M bits of encoded data according to the D error detection bits.

Abstract: Embodiments include a resistor, coupled on a signal path, that includes one or more resistive memory elements, such as one or more magnetic tunnel junctions (MTJs). The resistance of the resistive memory elements may be digitally trimmable to adjust a resistance of the resistor on the signal path. The resistor may be incorporated into an analog or mixed signal circuit to pass an analog signal on the signal path. Other embodiments may be described and claimed.

Abstract: Described is an apparatus which comprises: a first die including: a processing core; a crossbar switch coupled to the processing core; and a first edge interface coupled to the crossbar switch; and a second die including: a first edge interface positioned at a periphery of the second die and coupled to the first edge interface of the first die, wherein the first edge interface of the first die and the first edge interface of the second die are positioned across each other; a clock synchronization circuit coupled to the second edge interface; and a memory interface coupled to the clock synchronization circuit.

Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.

Abstract: Described is an apparatus which comprises: a first power supply node to provide a first power supply; a second power supply node to provide a second power supply; a driver to operate on the first power supply, the driver to generate an output; and a receiver to operate on the second power supply, the receiver to receive the output from the driver and to generate a level-shifted output such that the receiver is operable to steer current from the second power supply to the first power supply.

Abstract: Embodiments include a resistor, coupled on a signal path, that includes one or more resistive memory elements, such as one or more magnetic tunnel junctions (MTJs). The resistance of the resistive memory elements may be digitally trimmable to adjust a resistance of the resistor on the signal path. The resistor may be incorporated into an analog or mixed signal circuit to pass an analog signal on the signal path. Other embodiments may be described and claimed.

Abstract: Embodiments include a resistor, coupled on a signal path, that includes one or more resistive memory elements, such as one or more magnetic tunnel junctions (Mils). The resistance of the resistive memory elements may be digitally trimmable to adjust a resistance of the resistor on the signal path. The resistor may be incorporated into an analog or mixed signal circuit to pass an analog signal on the signal path. Other embodiments may be described and claimed.

Abstract: Described is an apparatus for power management. The apparatus comprises: a first power supply node; a second power supply node; a controllable device coupled to the first power supply node and to the second power supply node, the controllable device operable to short the first power supply node to the second power supply node; a load coupled to the second power supply node; and a charge recovery pump (CRP) coupled to the first and second power supply nodes.

Abstract: In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

Abstract: Described is an apparatus which comprises: a first power supply node to provide a first power supply; a second power supply node to provide a second power supply; a driver to operate on the first power supply, the driver to generate an output; and a receiver to operate on the second power supply, the receiver to receive the output from the driver and to generate a level-shifted output such that the receiver is operable to steer current from the second power supply to the first power supply.

Abstract: Methods and apparatus relating to enhanced Data Bus Invert (EDBI) encoding for OR chained buses are described. In an embodiment, incoming data on a bus is encoded based at least in part on a determination of whether a next data value on the bus is going to transitioning from a valid value to a parked state. Other embodiments are also disclosed.

Abstract: In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.