Patents by Inventor Dino Sasaridis
Dino Sasaridis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240063084Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.Type: ApplicationFiled: October 31, 2023Publication date: February 22, 2024Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
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Patent number: 11837523Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.Type: GrantFiled: October 14, 2022Date of Patent: December 5, 2023Assignee: Tesla, Inc.Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
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Publication number: 20230037192Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.Type: ApplicationFiled: October 14, 2022Publication date: February 2, 2023Applicant: Tesla, Inc.Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
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Patent number: 11476179Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.Type: GrantFiled: October 25, 2016Date of Patent: October 18, 2022Assignee: Tesla, Inc.Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
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Publication number: 20200282851Abstract: A charging system for an electric vehicle is described. The charging system for an electric vehicle can have a power supply, a charging cable, a connector, and a cooling system. The charging cable can have a coolant conduit routed through the charging cable. The charging cable can also have a coolant return path formed within the charging cable jacket. The cooling system can pump coolant through the coolant conduit and coolant return path to remove heat from the charging cable during a charging process.Type: ApplicationFiled: March 5, 2020Publication date: September 10, 2020Inventors: Dino Sasaridis, Martin James Sukup, Colby Hastings, Daniel Wheaton Priestley, Daryl Zalan, Dafna Gabriela Szafer, Frank Spiteri
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Patent number: 10199804Abstract: A busbar locating component includes: one or more first attachments configured for attaching a busbar layer to the busbar locating component; one or more bays each configured to contain and position an assembly of transistors essentially perpendicular to the busbar layer for connection; and a plurality of slots, each slot configured to contain and position a busbar relative to the busbar layer for connection.Type: GrantFiled: December 1, 2014Date of Patent: February 5, 2019Assignee: Tesla, Inc.Inventors: Robert James Ramm, Dino Sasaridis, Colin Campbell, Wenjun Liu
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Publication number: 20180114740Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.Type: ApplicationFiled: October 25, 2016Publication date: April 26, 2018Applicant: Tesla Motors, Inc.Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
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Patent number: 9642276Abstract: In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.Type: GrantFiled: December 1, 2014Date of Patent: May 2, 2017Assignee: Tesla, Inc.Inventors: Robert James Ramm, Dino Sasaridis, Colin Campbell, Wenjun Liu
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Patent number: 9536671Abstract: An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.Type: GrantFiled: December 1, 2014Date of Patent: January 3, 2017Assignee: TELSA MOTORS, INC.Inventors: Robert James Ramm, Dino Sasaridis, Colin Campbell, Wenjun Liu
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Publication number: 20160156278Abstract: A busbar locating component includes: one or more first attachments configured for attaching a busbar layer to the busbar locating component; one or more bays each configured to contain and position an assembly of transistors essentially perpendicular to the busbar layer for connection; and a plurality of slots, each slot configured to contain and position a busbar relative to the busbar layer for connection.Type: ApplicationFiled: December 1, 2014Publication date: June 2, 2016Inventors: Robert James RAMM, Dino SASARIDIS, Colin CAMPBELL, Wenjun LIU
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Publication number: 20160155572Abstract: An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.Type: ApplicationFiled: December 1, 2014Publication date: June 2, 2016Inventors: Robert James RAMM, Dino SASARIDIS, Colin CAMPBELL, Wenjun LIU
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Publication number: 20160157374Abstract: In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.Type: ApplicationFiled: December 1, 2014Publication date: June 2, 2016Inventors: Robert James RAMM, Dino SASARIDIS, Colin CAMPBELL, Wenjun LIU
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Patent number: 8771013Abstract: A system and method for a shielded coaxial cable including a collar including a cylindrical housing having a cylindrical inner bore, the inner bore having top and bottom openings the top opening having a diameter about equal to an outer diameter of an outer insulating layer of the cable and the bottom opening having a diameter about equal to an outer diameter of a shield layer of the cable with a terminating portion of the shield layer exposed and returned over an exterior portion of said collar near the bottom opening with the terminating portion overlapping said exterior portion; and a termination ferrule joined to the terminating portion that overlaps the exterior portion to simultaneously provide an electrical communication between the shield layer and the collar and provide a strain relief for the shielded cable disposed within the inner bore.Type: GrantFiled: June 14, 2012Date of Patent: July 8, 2014Assignee: Tesla Motors, Inc.Inventors: Nicholas Robert Kalayjian, Dino Sasaridis, Benjamin David Dettmann
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Publication number: 20130337705Abstract: A system and method for a shielded coaxial cable including a collar including a cylindrical housing having a cylindrical inner bore, the inner bore having top and bottom openings the top opening having a diameter about equal to an outer diameter of an outer insulating layer of the cable and the bottom opening having a diameter about equal to an outer diameter of a shield layer of the cable with a terminating portion of the shield layer exposed and returned over an exterior portion of said collar near the bottom opening with the terminating portion overlapping said exterior portion; and a termination ferrule joined to the terminating portion that overlaps the exterior portion to simultaneously provide an electrical communication between the shield layer and the collar and provide a strain relief for the shielded cable disposed within the inner bore.Type: ApplicationFiled: June 14, 2012Publication date: December 19, 2013Applicant: TESLA MOTORS, INC.Inventors: Nicholas Robert Kalayjian, Dino Sasaridis, Benjamin David Dettmann