Patents by Inventor Dinphuoc V. Hoang

Dinphuoc V. Hoang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overmolded semiconductor package with a wirebond cage for EMI shielding
    Patent number: 8071431
    Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: December 6, 2011
    Assignee: Skyworks Solutions, Inc.
    Inventors: Dinphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
  • OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING
    Publication number: 20110084368
    Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
    Type: Application
    Filed: December 16, 2010
    Publication date: April 14, 2011
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Dinphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco