Abstract: An implantable medical lead configured for improved MRI safety and heating reduction performance is disclosed herein. In one embodiment, the lead includes a tubular body having a proximal end and a distal end with a lead connector near the proximal end. In this embodiment the lead further includes a conductor extending longitudinally within the tubular body and having a proximal end that is electrically coupled to the connector and a distal end electrically coupled to a contact pin. The lead in this embodiment further includes a filter element electrically coupled to a distal end of the contact pin and a flange electrically coupled between a proximal end of the filter element and a proximal portion of an electrode. In this embodiment the flange and the proximal portion of the electrode form at least a first part of a hermetic chamber enclosing the filter element.

Abstract: Disclosed herein is an implantable pulse generator. The implantable pulse generator includes a header, a can, a feedthru, a feedthru substrate and a conductor. The header includes a lead connector block. The can is coupled to the header and includes a wall and an electronic substrate housed within the wall. The feedthru is mounted in the wall and includes a header side, a can side and a feedthru wire extending through the feedthru and having a first end and a second end opposite the first end. The first end is electrically coupled to the lead connector block. The feedthru substrate is adjacent the can side and includes capacitance layers, an electrically conductive input layer, and an electrically conductive input surface defined on a surface of the feedthru substrate and electrically coupled to the input layer. The input layer is electrically coupled to the second end. The conductor electrically couples the input surface and the electronic substrate. The conductor may be in the form of a wire bond.

Abstract: An implantable medical lead configured for improved MRI safety and heating reduction performance is disclosed herein. In one embodiment, the lead includes a tubular body having a proximal end and a distal end with a lead connector near the proximal end. In this embodiment the lead further includes a conductor extending longitudinally within the tubular body and having a proximal end that is electrically coupled to the connector and a distal end electrically coupled to a contact pin. The lead in this embodiment further includes a filter element electrically coupled to a distal end of the contact pin and a flange electrically coupled between a proximal end of the filter element and a proximal portion of an electrode. In this embodiment the flange and the proximal portion of the electrode form at least a first part of a hermetic chamber enclosing the filter element.

Abstract: A body fluid pressure sensor module according to the invention comprises a housing having a first end and a second end and enclosing a pressure sensor. The pressure sensor is electrically coupled to a plurality of electrical conductors extending into the housing through a feedthrough disposed within, and hermetically sealing, the first end of the housing. The housing defines a chamber disposed between the feedthrough and the second end of the housing. The chamber contains a material in communication with the pressure sensor, the material being capable of transmitting pressure variations to the pressure sensor. The plurality of electrical conductors have ends within the housing, and the pressure sensor is mounted on the end of at least one of the conductors. Also disclosed are medical leads incorporating the pressure sensor module, and methods for fabricating the modules.

Abstract: A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating “chip-and-wire” microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.

Abstract: A flat ribbon cable for interconnecting electrical components mounted in mating clamshell enclosure halves of an implantable cardiac stimulation device. The ribbon cable is configured to butterfly open when the enclosure is opened and interconnect components in each half without undergoing undue mechanical stress as the halves are distanced. The ribbon cable is also configured to fold together when the enclosure halves are mated together, without bending, in a very compact manner so as to occupy minimal room in the enclosure when the device is ready for implantation thus preserving more room for batteries, capacitors, and other electrical devices providing the sensing and stimulation functions of the device and/or allowing the overall space envelope of the stimulation device to be reduced.