Abstract: A connecting device for contacting a semiconductor component to at least one further component, the connecting device comprising at least one metal connecting strip extending in a longitudinal direction and having a contact region for mounting on a terminal region of the semiconductor component. In order to achieve a contacting system that can be manufactured inexpensively but can nevertheless carry high current densities, a connecting device is proposed whose contact region is embodied in structured fashion and flexibly with respect to stresses that extend in a terminal plane parallel to the terminal region.

Abstract: A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

Abstract: A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

Abstract: An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Abstract: A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

Abstract: A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

Abstract: A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g.

Abstract: A connecting device for contacting a semiconductor component to at least one further component, the connecting device comprising at least one metal connecting strip extending in a longitudinal direction and having a contact region for mounting on a terminal region of the semiconductor component. In order to achieve a contacting system that can be manufactured inexpensively but can nevertheless carry high current densities, a connecting device is proposed whose contact region is embodied in structured fashion and flexibly with respect to stresses that extend in a terminal plane parallel to the terminal region.

Abstract: A controller and rectifier for an electrical machine, in particular a three-phase generator for motor vehicles, is proposed in which the controller (13) and the rectifier (16) are embodied as an one-piece module (10).

Abstract: An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Abstract: A controller and rectifier for an electrical machine, in particular a three-phase generator for motor vehicles, is proposed in which the controller (13) and the rectifier (16) are embodied as an one-piece module (10).

Abstract: A cooling device for semiconductor modules having: a cooler bar for accommodating at least one, particularly actively cooled semiconductor module; at least one first channel, particularly a bore hole, in the cooler bar for the passage of a, in particular, liquid coolant; and at least one second channel, particularly a bore hole, in the cooler bar for the feeding and/or return of the coolant to/from the semiconductor module.

Abstract: A cooling device for semiconductor modules having: a cooler bar for accommodating at least one, particularly actively cooled semiconductor module; at least one first channel, particularly a bore hole, in the cooler bar for the passage of a, in particular, liquid coolant; and at least one second channel, particularly a bore hole, in the cooler bar for the feeding and/or return of the coolant to/from the semiconductor module.

Abstract: A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends (11) and external terminal ends (10) that are electrically connected to the internal terminal ends by metal strip conductors (12), the semiconductor component and the punched grid being joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends,whereby a metal strip grid, in particular a punched grid, which, even before being joined to the semiconductor component, has already been embedded on at least one side in at least one part