Patents by Inventor Dirk Plaueln

Dirk Plaueln has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Machine workpiece handling
    Patent number: 11192167
    Abstract: A loading and unloading device for a machine, a machine for machining panel-like workpieces, and a workpiece support for such a machine and a method for loading and unloading such a machine, having a loading and unloading module, wherein the loading and unloading module has a vertically upwardly oriented raising device for lifting a cut-free workpiece part and a vertically downwardly oriented gripping device (38) for holding an unmachined, panel-like workpiece.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: December 7, 2021
    Assignees: TRUMPF Werkzeugmaschinen GmbH + Co. KG, J. Schmalz GmbH
    Inventors: Magnus Deiss, Peter Epperlein, Frank Schmauder, Fabian Gaeckle, Jens Ottnad, Heinz-Juergen Prokop, Stefan Stroebel, Walter Dunkmann, Thomas Eisele, Rainer Hoehn, Dirk Plaueln, Hermann Reinisch
  • MACHINE WORKPIECE HANDLING
    Publication number: 20190091754
    Abstract: A loading and unloading device for a machine, a machine for machining panel-like workpieces, and a workpiece support for such a machine and a method for loading and unloading such a machine, having a loading and unloading module, wherein the loading and unloading module has a vertically upwardly oriented raising device for lifting a cut-free workpiece part and a vertically downwardly oriented gripping device (38) for holding an unmachined, panel-like workpiece.
    Type: Application
    Filed: November 27, 2018
    Publication date: March 28, 2019
    Inventors: Magnus Deiss, Peter Epperlein, Frank Schmauder, Fabian Gaeckle, Jens Ottnad, Heinz-Juergen Prokop, Stefan Stroebel, Walter Dunkmann, Thomas Eisele, Rainer Hoehn, Dirk Plaueln, Hermann Reinisch
  • METHOD FOR DETACHING WAFERS FROM A WAFER CARRIER AND DEVICE FOR THIS PURPOSE
    Publication number: 20110209324
    Abstract: In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane. It remains therein and is enclosed in an ungluing basin by movable wall parts. Solvent for ungluing is applied into the ungluing basin and onto the wafers after the formation and closing of the ungluing basin to dissolve the glued bond and subsequently detach the wafers from the carrier unit.
    Type: Application
    Filed: April 15, 2011
    Publication date: September 1, 2011
    Applicant: Gebr. Schmid GmbH & Co.
    Inventors: Jorg Lampprecht, Dirk Plaueln, Gerhard Wolber, Lechen Wolber, Michael Wolber, Hans-Jorg Wolber