Abstract: An optical sensor includes a pixel including a photoactive region configured to convert photons into charge carriers, a first and a second modulation gate configured to be modulated for indirect time of flight measurement, a first and a second storage node arranged on opposite sides of the photoactive region, the first and second storage nodes being configured to pin electrons generated in the photoactive region when the first or the second modulation gate is active, respectively, and a first field plate arranged next to the first storage node and a second field plate arranged next to the second storage node. The first and second field plates are configured to be supplied with a negative bias voltage such that the first and second field plates provide electrical isolation for the first or the second storage node, respectively.

Abstract: An optical sensor includes a pixel that includes: a photoactive region configured to convert photons into electrons and holes, first and second modulation gates configured to be modulated for indirect time of flight measurement, the first and second modulation gates being arranged on a front side of the pixel, first and second trenches arranged on opposite lateral sides of the photoactive region, and a first memory part arranged laterally next to the first trench and at least partially separated from the photoactive region by the first trench and a second memory part arranged laterally next to the second trench and at least partially separated from the photoactive region by the second trench, the first and second memory parts being configured to bin electrons generated in the photoactive region, and the first and second trenches are configured as reflective structures for photons in the photoactive region.

Abstract: An image sensor device includes a pixel. The pixel includes a semiconductor layer having a first surface. A photodiode is formed in the semiconductor layer and is configured to generate charge carriers based on light reaching the photodiode. A storage node is formed in the semiconductor layer, the storage node being arranged so that charge carriers generated in the photodiode are transferred to the storage node. A light-shielding structure is formed in the semiconductor layer and is disposed at least between the first surface of the semiconductor layer and the storage node so as to prevent at least part of the light travelling in the semiconductor layer away from the first surface from reaching the storage node.

Abstract: In a process of fabricating on a substrate a CMOS semiconductor device having a gate electrode, a raised source, and a raised drain, the improvement comprising further incorporating a raised extension, comprising:

Abstract: A lateral IGBT in an SOI configuration having a top side and an underside is proposed. The lateral IGBT has a drain zone extending to the top side and is of a first conductivity type. The underside of the LIGBT forms a substrate of a second conductivity type. A lateral insulation layer is situated between the substrate and the drain zone. At least one laterally formed region of the second conductivity type is situated in the drain zone, in the vicinity of the lateral insulation layer. These laterally formed regions being spaced apart from one another lying in one plane.