Abstract: An ozone generator includes a discharge chamber; an inlet opening for feeding air into the discharge chamber; an outlet opening for removing ozone from the discharge chamber; and at least two cylindrical electrode sets in the discharge chamber. Each electrode set includes a ground electrode; a high voltage electrode; a dielectric between the ground electrode and the high voltage electrode; the dielectric separated from the ground electrode by a first discharge gap, and the dielectric separated from the high voltage electrode by a second discharge gap. A high voltage power supply provides a voltage impulse to the high voltage electrode of at least 2 kV (at least 5 kV is most cases), and a peak current of at least 1 ampere (at least 4 amperes in most cases). The high voltage power supply provides a dU/dt of the voltage impulse of between 5 kV/?sec and 50 kV/?sec.

Abstract: A plasma chemical reactor including an anode having a generally cylindrical shape and an axis of rotational symmetry; a cathode inside the anode and co-axial with the anode; a hot plasma channel between the between the anode and the cathode; a gas input module providing gas flow into the anode; a gas output module at a distal end of the anode; and a high voltage power supply providing with a current in a range of 0.1-1.0 A. The high voltage power supply provides a voltage to the cathode in a range of 0-5 kV, a power of at least 1 kW, and a voltage/current ratio of at least 1000 V/A.

Abstract: An ozone generator includes a discharge chamber; an inlet opening for feeding air into the discharge chamber; an outlet opening for removing ozone from the discharge chamber; and at least two cylindrical electrode sets in the discharge chamber. Each electrode set includes a ground electrode; a high voltage electrode; a dielectric between the ground electrode and the high voltage electrode; the dielectric separated from the ground electrode by a first discharge gap, and the dielectric separated from the high voltage electrode by a second discharge gap. A high voltage power supply provides a voltage impulse to the high voltage electrode of at least 2 kV (at least 5 kV is most cases), and a peak current of at least 1 ampere (at least 4 amperes in most cases). The high voltage power supply provides a dU/dt of the voltage impulse of between 5 kV/?sec and 50 kV/?sec.

Abstract: A plasma chemical reactor including an anode having a generally cylindrical shape and an axis of rotational symmetry; a cathode inside the anode and co-axial with the anode; a hot plasma channel between the between the anode and the cathode; a gas input module providing gas flow into the anode; a gas output module at a distal end of the anode; and a high voltage power supply providing with a current in a range of 0.1-1.0 A. The high voltage power supply provides a voltage to the cathode in a range of 0-5 kV, a power of at least 1 kW, and a voltage/current ratio of at least 1000 V/A.

Abstract: A plasma generation system includes an anode having a generally cylindrical proximal portion and a generally cylindrical distal portion, the distal portion having a smaller diameter than the first portion; a connecting portion connecting the first and second portions and having walls oriented at approximately 45 degrees to center axis of the anode; a cathode having a generally cylindrical shape in its proximal portion and a tapering at approximately a 30 degree angle to the center axis of the anode in its distal portion, where a gap between the connecting portion of the anode and the distal portion of the cathode is at least twice as large as a gap between the proximal portion of the anode and the proximal portion of the cathode; and a high voltage power supply providing an operating voltage in a range of 800-2500 volts and a current of about 0.3-0.7 A to the cathode.

Abstract: Aspects of the disclosed techniques relate to techniques for resist simulation in lithography. Local minimal light intensity values are determined for a plurality of sample points in boundary regions of an aerial image of a feature to be printed on a resist coating, wherein each of the local minimal light intensity values represents a minimum light intensity value for an area surrounding one of the plurality of sample points. Based on the local minimal light intensity values, horizontal development bias values for the plurality of sample points are then determined. Finally, resist contour data of the feature are determined based at least on the horizontal development bias values.

Abstract: Aspects of the disclosed techniques relate to techniques for resist simulation in lithography. Local light power values are determined for a plurality of sample points in boundary regions of an aerial image of a feature to be printed on a resist coating, wherein each of the local light power values represents a light power value for an area surrounding one of the plurality of sample points. Based on the local light power values, a vertical shrinkage function is constructed. Resist contour data of the feature are then computed based at least on resist shrinkage effects modeled using the local light power values and the vertical shrinkage function.

Abstract: The invention is a method and system for the generation of high voltage, pulsed, periodic corona discharges capable of being used in the presence of conductive liquid droplets. The method and system can be used, for example, in different devices for cleaning of gaseous or liquid media using pulsed corona discharge. Specially designed electrodes and an inductor increase the efficiency of the system, permit the plasma chemical oxidation of detrimental impurities, and increase the range of stable discharge operations in the presence of droplets of water or other conductive liquids in the discharge chamber.

Abstract: The invention is a method and system for the generation of high voltage, pulsed, periodic corona discharges capable of being used in the presence of conductive liquid droplets. The method and system can be used, for example, in different devices for cleaning of gaseous or liquid media using pulsed corona discharge. Specially designed electrodes and an inductor increase the efficiency of the system, permit the plasma chemical oxidation of detrimental impurities, and increase the range of stable discharge operations in the presence of droplets of water or other conductive liquids in the discharge chamber.

Abstract: A grid-based resist simulator predicts how a wafer coated with one or more resist layers will develop when exposed with a mask pattern. Image intensity values are calculated at a grid of points on the wafer, and the image intensity points are analyzed with a resist simulator that produces a resist surface function. A threshold contour of the resist surface function defines how the mask pattern will print on a wafer.

Abstract: A grid-based resist simulator predicts how a wafer coated with one or more resist layers will develop when exposed with a mask pattern. Image intensity values are calculated at a grid of points on the wafer, and the image intensity points are analyzed with a resist simulator that produces a resist surface function. A threshold contour of the resist surface function defines how the mask pattern will print on a wafer.