Abstract: Disclosed is a printing apparatus for a 3D surface, which performs printing by ejecting a droplet onto a 3D surface and controlling an electric field on an impact path of the droplet, the printing apparatus including: a ejecting environment information provider configured to provide ejecting environment information between a nozzle and an impact point; and a controller configured to predict a result of printing on an actual substrate by accumulating previous printing results according to printing conditions and the ejecting environment information into a database, and perform the printing on the 3D surface while changing the printing conditions provided by the database based on the ejecting environment information provided by the ejecting environment information provider.

Abstract: A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.

Abstract: An integrated circuit and an electronic device including the integrated circuit are provided. An integrated circuit includes a sequential logic circuit, which includes a first scan cell that is configured to receive a scan input, and a plurality of scan cells sequentially connected in series from the first scan cell, a control unit, which is configured to receive a selection signal including an output of each of the plurality of scan cells, and is further configured to output a control signal responsive to the selection signal, and a monitoring circuit, which is configured to receive the control signal, is configured to perform first monitoring of first data at a first node that is an observation node in the sequential logic circuit responsive to the control signal, and is configured to output a result of the first monitoring to a monitoring node.

Abstract: A method of testing a semiconductor integrated circuit including a one-time programmable (OTP) memory device is provided. A program command is transferred from a tester to the OTP memory device. Programming and a programming verification are performed with respect to OTP memory cells in the OTP memory device in response to the program command. The OTP device generates accumulated verification result signal by accumulating program verification results with respect to the OTP memory cells. The accumulated verification result signal is transferred from the OTP memory device to the tester.

Abstract: A method of testing a semiconductor integrated circuit including a one-time programmable (OTP) memory device is provided. A program command is transferred from a tester to the OTP memory device. Programming and a programming verification are performed with respect to OTP memory cells in the OTP memory device in response to the program command. The OTP device generates accumulated verification result signal by accumulating program verification results with respect to the OTP memory cells. The accumulated verification result signal is transferred from the OTP memory device to the tester.

Abstract: A semiconductor test system capable of performing a virtual test and a semiconductor test method thereof. The semiconductor test system includes a tester providing a test signal and an emulator providing a virtual test result to the tester in response to the test signal. The emulator includes virtual prober software to obtain the virtual test result.

Abstract: A method for testing a semiconductor device includes generating chip identification data for each of a plurality of devices under test to collect a plurality of chip identification data respectively corresponding to the plurality of devices under test. The plurality of chip identification data for the plurality of devices under test is transmitted responsive to collection thereof. The plurality of chip identification data may be received and written in parallel to the corresponding ones of the plurality of devices under test. Related apparatus are also discussed.

Abstract: An apparatus for testing a semiconductor device includes: a power supplying unit for generating a voltage to be supplied to the semiconductor device under control of a test controller; a voltage transmitting unit for transmitting the voltage to the semiconductor device under control of the test controller; and an overcurrent detecting unit for detecting whether an overcurrent is supplied from an output of the power supplying unit, wherein the voltage transmitting unit cuts off a voltage supply to the semiconductor device in response to an output of the overcurrent detecting unit without intervention of the test controller.

Abstract: A test system that tests first through m-th circuit devices for defects. The test system includes a controller and first through m-th control circuits. The controller is configured to generate a test signal having information for testing first through m-th circuit devices. The first through m-th control circuits are each configured to test a respective one of the first through m-th circuit devices for a defect using the test signal, and to stop testing the respective one of the first through m-th circuit devices when a defect is identified.

Abstract: A test apparatus simultaneously tests a plurality of semiconductor integrated circuits according to test data stored in a single memory set. A sub-test data generator includes a plurality of data reproduction units, each of which corresponds to one of the integrated circuits being tested. Each data reproduction unit reproduces the stored test data into a reproduced test data set, which is then processed by a driver, and sent to the corresponding integrated circuit for testing.

Abstract: A test system that tests first through m-th circuit devices for defects. The test system includes a controller and first through m-th control circuits. The controller is configured to generate a test signal having information for testing first through m-th circuit devices. The first through m-th control circuits are each configured to test a respective one of the first through m-th circuit devices for a defect using the test signal, and to stop testing the respective one of the first through m-th circuit devices when a defect is identified.

Abstract: A test apparatus simultaneously tests a plurality of semiconductor integrated circuits according to test data stored in a single memory set. A sub-test data generator includes a plurality of data reproduction units, each of which corresponds to one of the integrated circuits being tested. Each data reproduction unit reproduces the stored test data into a reproduced test data set, which is then processed by a driver, and sent to the corresponding integrated circuit for testing.