Patents by Inventor Do-Hyoung Lee

Do-Hyoung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951928
    Abstract: A roof airbag for a vehicle includes: an airbag cushion located at a roof panel of the vehicle and configured to be unfolded from a first side portion to a second side portion of the roof panel during an operation of the airbag cushion; a first seam portion extended in a direction intersected with an unfolded direction of the airbag cushion and allowing upper and lower surfaces of the airbag cushion to be in contact with each other; and an inflator coupled to the first side portion of the roof panel, and connected to the airbag cushion and configured to inject gas into the airbag cushion so as to allow the airbag cushion to be unfolded from the first side portion to the second side portion of the roof panel.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 9, 2024
    Assignee: Hyundai Mobis Co., Ltd.
    Inventors: Dong Oh Lee, Byung Ho Min, Do Hyoung Kim
  • Publication number: 20240108406
    Abstract: The present invention relates to a renal denervation catheter which detects contact of a heating electrode with a renal vessel surface and detects reaction sensitivity of a target nerve by a detection electrode so as to excise only the target nerve. To this end, the renal denervation catheter is disclosed, wherein the renal denervation catheter comprises: a catheter housing; an electrode part provided in a housing, emitting a contact detection RF signal for contact with the inner wall of the renal vessel according to a contact detection mode, and emitting a denervation RF signal for renal denervation according to a denervation mode; a control part for allowing to enter the denervation mode when a contact detection feedback signal value generated by the contact detection mode satisfies a defined condition.
    Type: Application
    Filed: April 5, 2021
    Publication date: April 4, 2024
    Inventors: Do-hyoung KIM, Won-jang Lee
  • Patent number: 8679587
    Abstract: Disclosed embodiments concern solution deposition of at least a first inorganic compound on a substrate, typically for production of electronic devices, such as solution deposition of metal salts, including halides, carbonyls, acetates, sulfates, phosphates, carbonates, and mixtures thereof. Solutions may be deposited using any suitable process, particularly inkjet printing or spin coating. The method can involve depositing only a first solution, depositing a first solution plural times, or deposition of plural different solutions. Furthermore, the method may involve simultaneous or serial deposition of two or more solutions. The method may further comprise post deposition processing the deposited material, such as thermal annealing, oxidation processes, reduction processes, exchange reactions, and combinations thereof.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: March 25, 2014
    Assignee: State of Oregon acting by and through the State Board of Higher Education action on Behalf of Oregon State University
    Inventors: Chih-hung Chang, Do-Hyoung Lee, Yu-Jen Chang
  • Publication number: 20060121737
    Abstract: A method includes providing a first distance between an inlet of a line and a chuck for supporting a substrate. A first material is applied to the substrate on the chuck through the line to process the substrate. A second distance is provided between the inlet of the line and the chuck. Byproducts generated during processing of the substrate are then removed using a second material. Here, the second material has reactivity with respect to the chuck having the second distance from the inlet smaller than that of the second material with respect to the chuck having the first distance from the inlet. A distance between the chuck and the inlet of the line is adequately adjusted in the process using the plasma gas so that the substrate on the chuck may not be moved.
    Type: Application
    Filed: November 30, 2005
    Publication date: June 8, 2006
    Inventors: Jae-Hyun Han, Do-Hyoung Lee, Seung-Ki Chae