Patents by Inventor Dolibor Hodko

Dolibor Hodko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Well designs for electrokinetic remediation
    Patent number: 6203682
    Abstract: The invention provides an apparatus for electrokinetic transport through soil, comprising an electrode and a containment surrounding the electrode, the containment comprising a layer of a porous material and a rigid porous member disposed between the electrode and the porous material to support or secure the first material. The porous material and rigid porous member allow passage of water, hydrogen ions, hydroxyl ions and one or more target ions. A preferred porous material is clay or ceramic and a preferred rigid porous member is a perforated plastic tube.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: March 20, 2001
    Assignee: Lynntech, Inc.
    Inventor: Dolibor Hodko
  • Electronically conducting polymers with silver grains
    Patent number: 5919402
    Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: July 6, 1999
    Assignee: Lynntech, Inc.
    Inventors: Oliver J. Murphy, G. Duncan Hitchens, Dolibor Hodko
  • Electronically and ionically conducting polymer matrix
    Patent number: 5871672
    Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.
    Type: Grant
    Filed: August 30, 1996
    Date of Patent: February 16, 1999
    Inventors: Oliver J. Murphy, G. Duncan Hitchens, Dolibor Hodko