Abstract: Aspects of the invention include a method for providing a master computing environment containing a master repository. The method periodically conducts a search of proprietary data repositories and causes the master computing environment to create a merged collection in the master repository after the periodical conducted search of the proprietary data repositories. The method correlates metadata with the proprietary data repositories and puts the correlated metadata into the master repository. The method sets up a question feeder server to receive queries and to pass the queries to the master computing environment. The method causes the master computing environment to provide results in response to a query, where the master computing environment acts as an autonomous information provider that finds and sorts subject matter on a proprietary development project.

Abstract: A computer-implemented method includes monitoring, by an agent, resource consumption at a system running at an on-premises data center, where the agent is embedded into the system. Compliance data is determined by measuring, by the agent, the resource consumption according to one or more cost factors of a consumption-based pricing agreement. The compliance data is useable to determine a consumption-based price of operating the system according to the consumption-based pricing agreement.

Abstract: Aspects of the invention include a method for providing a master computing environment containing a master repository. The method periodically conducts a search of proprietary data repositories and causes the master computing environment to create a merged collection in the master repository after the periodical conducted search of the proprietary data repositories. The method correlates metadata with the proprietary data repositories and puts the correlated metadata into the master repository. The method sets up a question feeder server to receive queries and to pass the queries to the master computing environment. The method causes the master computing environment to provide results in response to a query, where the master computing environment acts as an autonomous information provider that finds and sorts subject matter on a proprietary development project.

Abstract: A computer-implemented method includes monitoring, by an agent, resource consumption at a system running at an on-premises data center, where the agent is embedded into the system. Compliance data is determined by measuring, by the agent, the resource consumption according to one or more cost factors of a consumption-based pricing agreement. The compliance data is useable to determine a consumption-based price of operating the system according to the consumption-based pricing agreement.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.