Abstract: An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Abstract: The invention relates to an apparatus for mounting semiconductor chips as flip chip on a substrate. The apparatus comprises means for supplying the semiconductor chips, a pick-and-place system with a bonding head with a chip gripper, a flipping apparatus with a gripper and two cameras. The first camera is used for determining the actual position of the semiconductor chip that is provided by the said means for mounting before the flipping apparatus receives the semiconductor chip, and it is used to determine the actual position of the flip chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the semiconductor chip. The apparatus comprises an optical switch in accordance with the invention, e.g., a rotatably held mirror which is located in the field of view of the first camera. In operation, the mirror is rotated simultaneously with the gripper of the flipping apparatus, but only by half the angle.

Abstract: The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container, which accommodates the soldering flux and is open on the bottom, and a base plate, which contains at least one cavity, are moved back-and-forth in relation to one another on one side of the cavity to the other side of the cavity. The viewed in the movement direction front wall of the container is lifted up during the relative movement, so that it is located at a distance above the base plate. The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the base plate. This measure has the effect that the front wall of the container does not convey any soldering flux onto the base plate, which has caused the loss of this soldering flux until now.

Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.