Patents by Inventor Dominik Wilding

Dominik Wilding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11882648
    Abstract: A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 23, 2024
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Thomas Kristl, Dominik Wilding
  • Publication number: 20230105997
    Abstract: A component carrier includes a layer stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, at least one opening in the layer stack, a first curable dielectric element arranged at least partially on the opening, and a second curable dielectric element arranged adjacent to the first curable dielectric element, so that there is an interface region in between. A part of the first curable dielectric element extends partially into the opening.
    Type: Application
    Filed: September 22, 2022
    Publication date: April 6, 2023
    Inventors: Thomas WULZ, Daniel SCHLICK, Sebastian LACKNER, Dominik WILDING
  • Publication number: 20220287181
    Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and a plurality of electrically insulating layer structure, a first component, a second component, a central core in which both the first component and the second component are embedded. A first electrically insulating structure encapsulates the first component. A second electrically insulating structure encapsulates the second component. The first component and the second component are electrically connected to an external electrically conductive structure through at least one electrically conductive contact passing through the first electrically insulating structure and/or the second electrically insulating structure.
    Type: Application
    Filed: May 16, 2022
    Publication date: September 8, 2022
    Inventors: Dominik WILDING, Artan BAFTIRI
  • Publication number: 20210315093
    Abstract: A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.
    Type: Application
    Filed: March 26, 2021
    Publication date: October 7, 2021
    Inventors: Thomas Kristl, Dominik Wilding