Abstract: An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.

Abstract: An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.

Abstract: A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component. The method further comprises synthesizing a plurality of thread-like structures over the substrate to collectively form one or more electrically conductive projections extending transverse to the mounting surface. The one or more electrically conductive projections include one or more wall-like structures which are elongate parallel to the mounting surface. The electrically conductive projections can be transferred to another surface such as a major surface of a second substrate. There are further provided a support structure and a guard structure having the wall-like electrically conductive projections which are electrically grounded when in use to provide signal isolation.

Abstract: A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component. The method further comprises synthesizing a plurality of thread-like structures over the substrate to collectively form one or more electrically conductive projections extending transverse to the mounting surface. The one or more electrically conductive projections include one or more wall-like structures which are elongate parallel to the mounting surface. The electrically conductive projections can be transferred to another surface such as a major surface of a second substrate. There are further provided a support structure and a guard structure having the wall-like electrically conductive projections which are electrically grounded when in use to provide signal isolation.

Abstract: The present invention relates to a microwave electronic device (1) comprising a metal enclosure (2) having a bottom (21) and a lid (23) and containing an electronic circuit board (3) disposed substantially parallel to said bottom and to said lid, said circuit board having: conductive bottom and top grounding layers (41, 42) respectively disposed on bottom and top faces (31, 32) of the circuit board, and perforations (7a) transverse to said faces of the circuit board and delimited by conductive walls (71) for electrically interconnecting said layers (41, 42). At least some of said walls (71) are electrically connected to the lid of the enclosure by conductive grounding members (8a). Each conductive member (8a) has a metal blade covered with a material (13, 13?) for absorbing microwaves.

Abstract: The present invention relates to a microwave electronic device (1) comprising a metal enclosure (2) having a bottom (21) and a lid (23) and containing an electronic circuit board (3) disposed substantially parallel to said bottom and to said lid, said circuit board having: